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1. (WO2018169012) DISPERSION, METHOD FOR PRODUCING CONDUCTIVE PATTERN-EQUIPPED STRUCTURE BY USING DISPERSION, AND CONDUCTIVE PATTERN-EQUIPPED STRUCTURE

Pub. No.:    WO/2018/169012    International Application No.:    PCT/JP2018/010287
Publication Date: Fri Sep 21 01:59:59 CEST 2018 International Filing Date: Fri Mar 16 00:59:59 CET 2018
IPC: H01B 1/22
H01B 1/00
H01B 13/00
H05K 1/09
H05K 3/12
Applicants: ASAHI KASEI KABUSHIKI KAISHA
旭化成株式会社
Inventors: OHNO, Eiichi
大野 栄一
YUMOTO, Toru
湯本 徹
TSURUTA, Masanori
鶴田 雅典
Title: DISPERSION, METHOD FOR PRODUCING CONDUCTIVE PATTERN-EQUIPPED STRUCTURE BY USING DISPERSION, AND CONDUCTIVE PATTERN-EQUIPPED STRUCTURE
Abstract:
The present invention forms a conductive pattern which exhibits low resistance on a substrate, and also exhibits high dispersion stability. A dispersion (1) including a copper oxide (2), a dispersion agent (3), and a reducing agent, wherein the reducing agent content falls within the range specified by formula (1), and the dispersion agent content falls within the range specified by formula (2). (1): 0.0001≤(reducing agent mass/copper oxide mass)≤0.10. (2): 0.0050≤(dispersion agent mass/copper oxide mass)≤0.30. Copper sintering is accelerated by promoting the reduction of copper oxide to copper during firing by inclusion of the reducing agent.