检索国际和国家专利汇编

1. (WO2017038969) MOLDING DIE DEVICE AND MOLDING METHOD

Pub. No.:    WO/2017/038969    International Application No.:    PCT/JP2016/075776
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Sat Sep 03 01:59:59 CEST 2016
IPC: B29C 51/36
B29C 49/04
B29C 49/42
B29C 51/02
B29C 51/10
B29C 51/26
Applicants: KYORAKU CO.,LTD.
キョーラク株式会社
Inventors: FUKUDA Tatsuya
福田 達也
Title: MOLDING DIE DEVICE AND MOLDING METHOD
Abstract:
[Problem] To provide a molding die device whereby a resin sheet can reliably be adhered to a die cavity without the molding die device having a complex die structure or driving mechanism. [Solution] A molding die device for causing a resin sheet to adhere to a die by vacuum suction from a cavity surface and molding the resin sheet. In the present invention, outer frame parts are formed integrally with external peripheral portions of each of a pair of dies disposed facing each other, and a recess capable of accommodating the outer frame part of one of the dies is formed in the one die in a position thereof facing the outer frame part of the other die. The outer frame parts are formed so as to be the most protruding portion of each die. During molding, a resin sheet is disposed so as to be in contact with the outer frame parts, and vacuum suction is performed, after which the pair of dies is closed.