检索国际和国家专利汇编

1. (WO2013146700) RESIN COMPOSITION, PREPREG AND LAMINATE

Pub. No.:    WO/2013/146700    International Application No.:    PCT/JP2013/058625
Publication Date: Fri Oct 04 01:59:59 CEST 2013 International Filing Date: Tue Mar 26 00:59:59 CET 2013
IPC: C08L 63/00
B32B 15/08
B32B 15/092
C08G 59/40
C08J 5/24
C08K 3/00
C08K 3/10
C08L 61/14
Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC.
三菱瓦斯化学株式会社
Inventors: SAITO, Chisato
斎藤 千里
UEYAMA, Daisuke
植山 大輔
SOGAME, Masanobu
十亀 政伸
MABUCHI, Yoshinori
馬渕 義則
KATO, Yoshihiro
加藤 禎啓
Title: RESIN COMPOSITION, PREPREG AND LAMINATE
Abstract:
Provided are: a resin composition which is capable of easily providing, with good reproducibility, a laminate, a printed wiring board or the like that has not only excellent heat dissipation characteristics but also good moldability, good mechanical drilling processability and excellent appearance; and a prepreg, a metal foil-clad laminate and the like, each of which uses the resin composition. A resin composition which contains (A) a cyanic acid ester compound, (B) an epoxy resin, (C) a first inorganic filler, (D) a second inorganic filler and (E) a molybdenum compound, and wherein the ratio of the average particle diameter of the first inorganic filler (C) to the average particle diameter of the second inorganic filler (D) is from 1:0.02 to 1:0.2.