检索国际和国家专利汇编

1. (WO2007105555) NOISE SUPPRESSING STRUCTURE, MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SUCH MULTILAYER PRINTED CIRCUIT BOARD

Pub. No.:    WO/2007/105555    International Application No.:    PCT/JP2007/054418
Publication Date: Fri Sep 21 01:59:59 CEST 2007 International Filing Date: Thu Mar 08 00:59:59 CET 2007
IPC: H05K 1/02
H05K 3/46
H05K 9/00
Applicants: Shin-Etsu Polymer Co., Ltd.
信越ポリマー株式会社
KAWAGUCHI, Toshiyuki
川口 利行
TAHARA, Kazutoki
田原 和時
SAGA, Tsutomu
佐賀 努
Inventors: KAWAGUCHI, Toshiyuki
川口 利行
TAHARA, Kazutoki
田原 和時
SAGA, Tsutomu
佐賀 努
Title: NOISE SUPPRESSING STRUCTURE, MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SUCH MULTILAYER PRINTED CIRCUIT BOARD
Abstract:
A noise suppressing structure, which suppresses generation of conduction noise and radiation noise and can be reduced in thickness, a multilayer printed circuit board and a method for easily manufacturing such multilayer printed circuit board are provided. A noise suppressing structure (10) is provided with a first conductor (11), a noise suppressing layer (12) electromagnetically coupled with the first conductor through an insulating layer (13); and a second conductor (14) facing the noise suppressing layer through an insulating layer (13). The noise suppressing structure is a layer in which the noise suppressing layer (12) is formed by physically depositing a metal material on the insulating layer (13), and has a thickness of 5-300nm. The multilayer printed circuit board is provided with the noise suppressing structure. The method for manufacturing the multilayer printed circuit board is provided with a step of removing a part of the first conductor of the noise suppressing structure by etching, and a step of removing a part of the insulating layer between the first conductor and the noise suppressing layer and a part of the noise suppressing layer by etching by using the first conductor as a mask.