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1. (WO2019066945) INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES
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CLAIMS

I. A microelectronic die package comprising:

a die;

a package substrate attached to the die on one side of the die and configured to be connected to a system board;

a plurality of passive devices over a second side of the die; and

a plurality of passive device contacts over a respective passive device, the contacts being configured to be coupled to a second die mounted over the passive devices and over the second side of the die.

2. The package of Claim 1, wherein the package substrate is a redistribution layer.

3. The package of Claim 1 or 2, wherein the contacts comprise copper pillars.

4. The package any one or more of claims 1-3, wherein the passive devices are mounted to the die, the package further comprising a dielectric material over the die and between the passive devices.

5. The package of Claim 4, wherein the passive devices are embedded in the dielectric material.

6. The package of Claim 5, wherein the dielectric material is a mold compound.

7. The package of any one or more of claims 1-6, further comprising a molding compound over the die and the substrate to seal the die.

8. The package of Claim 7, wherein the mold compound includes through-mold vias between the substrate and a top surface of the mold compound.

9. The package of any one or more of claims 1-8, wherein the through- mold vias comprises copper pillars embedded in the mold compound.

10. The package of any one or more of claims 1-9, further comprising a second microelectronic die package over the passive device contacts, the second package having a plurality of package contacts to connect to the passive device contacts.

I I. The package of Claim 10, wherein the second device contacts are solder balls on one side of a redistribution layer and wherein the redistribution layer is coupled to a second microelectronic die on an opposite side.

12. The package of Claim 11, wherein the second package comprises a mold compound over the redistribution layer and the second microelectronic die.

13. The package of Claim 11, wherein the second microelectronic die is over the passive devices and wherein the passive devices are coupled through the passive device contacts and the redistribution layer to the second microelectronic die.

14. A method of fabricating a microelectronic die package comprising:

attaching a die to a package substrate on one side of substrate;

attaching a plurality of passive devices over the die on a second side of the die opposite the package substrate;

forming a plurality of passive device contacts over each respective passive device, the contacts being configured to be coupled to a second die mounted over the passive devices and over the second side of the die; and

attaching a ball grid array to the package substrate on a side opposite of the die and configured to be connected to a system board.

15. The method of Claim 14, wherein the contacts comprise copper pillars.

16. The method of Claim 14 or 15, further comprising applying a dielectric material over the die and between the passive devices so that the passive devices are embedded in the dielectric material.

17. The method of Claim 16, wherein the dielectric is a mold compound, the method further comprising forming through-mold vias between the substrate and a top surface of the mold compound.

18. A computing system comprising:

a system board;

a first microelectronic die package having a first die, a package substrate attached to the first die on one side of the die and connected to the system board, a plurality of passive devices over a second side of the first die, and a plurality of passive device contacts over a respective passive device; and

a second microelectronic die package over the passive device contacts, the second package having a plurality of package contacts to connect to the passive device contacts over the second side of the first die.

19. The computing system of Claim 18, wherein the passive devices are mounted to the die, the first package further comprising a dielectric material over the first die and between the passive devices, and wherein the passive devices are embedded in the dielectric material.

20. The computing system of Claim 19, wherein the dielectric material is a mold compound over the first die and the substrate to seal the first die.