Некоторое содержание этого приложения в настоящий момент недоступно.
Если эта ситуация сохраняется, свяжитесь с нами по адресуОтзывы и контакты
1. (WO2019063137) AN OPTOELECTRONIC COMPONENT
Примечание: Текст, основанный на автоматизированных процессах оптического распознавания знаков. Для юридических целей просьба использовать вариант в формате PDF

CLAIMS

An optoelectronic component (10, 20)

comprising a housing body (100) and an optical element (300) ,

wherein a rabbet (200) comprising a shoulder (210) and a cheek (220) is formed on an upper side (101) of the housing body (100) ,

wherein the optical element (300) is received in the rabbet (200) such that a brim (310) of the optical element (300) rests on the shoulder (210) of the rabbet (200) .

The optoelectronic component (10, 20) according to claim 1,

wherein a height (211) of the rabbet (200) differs from a thickness (311) of the brim (310) of the optical element (300) by less than 40%, preferably by less than 20%, preferably by less than 10%.

The optoelectronic component (10, 20) according to one of claims 1 and 2,

wherein a gap (250) is formed between the brim (310) of the optical element (300) and the cheek (220) of the rabbet (200),

wherein the gap (250) comprises a width (251) below

200 ym or below 100 ym.

The optoelectronic component (10, 20) according to one of the previous claims,

wherein an obtuse angle (230) is enclosed between the cheek (220) of the rabbet (200) and the shoulder (210) of the rabbet (200) .

The optoelectronic component (10, 20) according to one of the previous claims,

wherein a glue (260) is arranged between the shoulder (210) of the rabbet (200) and the brim (310) of the optical element (300) .

6. The optoelectronic component (10, 20) according to claim 5,

wherein the glue (260) extends to a region between the cheek (220) of the rabbet (200) and the brim (310) of the optical element (300).

7. The optoelectronic component (10, 20) according to one of the previous claims,

wherein the upper side (101) of the housing body (100) comprises a rectangular shape,

wherein the shoulder (210) of the rabbet (200) is formed only at the corners (240) of the rabbet (200) .

8. The optoelectronic component (10, 20) according to one of the previous claims,

wherein the housing body (100) comprises a cavity (110) having an opening (120) at the upper side (101) of the housing body (100) .

9. The optoelectronic component (10, 20) according to claim 8,

wherein the rabbet (200) encircles the opening (120) of the cavity (110) .

10. The optoelectronic component (10, 20) according to one of claims 8 and 9,

wherein the optical element (300) covers the opening (120) of the cavity (110) .

11. The optoelectronic component (10) according to one of claims 8 to 10,

wherein a side wall (140) of the cavity (110) forms a reflector (150) .

12. The optoelectronic component (10) according to claim 11, wherein the reflector (150) comprises a gold coating (160) .

13. he optoelectronic component (10) according to one of claims 11 and 12 and one of claims 5 and 6,

wherein the glue (260) partially covers the reflector (150) .

14. The optoelectronic component (10, 20) according to one of the previous claims,

wherein the optical element (300) comprises an optical lens (330) .

15. The optoelectronic component (10, 20) according to claim 14,

wherein the optical lens (330) is arranged on a lower side (302) of the optical element (300),

wherein the optical lens (330) extends into the cavity (110) .

16. The optoelectronic component (10, 20) according to one of claims 14 and 15,

wherein the optical lens (330) is asymmetric.

17. The optoelectronic component (10) according to one of the previous claims,

wherein the optoelectronic component (10) comprises a carrier (400) having a die attach pad (410) arranged on an upper side (401) of the carrier (400) and a solder pad

(430) arranged on a lower side (402) of the carrier

(400) ,

wherein the housing body (100) is arranged on the upper side (401) of the carrier (400) .

18. The optoelectronic component (10) according to claim 17, wherein at least one via contact (440) extends through the carrier (400) between the die attach pad (410) and the solder pad (430) .

19. he optoelectronic component (10) according to one of claims 17 and 18,

wherein a lower side (102) of the housing body (100) comprises a cut-out (130),

wherein an optoelectronic semiconductor chip (500) is arranged on the die attach pad (410) of the carrier (400) in the cut-out (130) of the housing body (100) .

20. An optoelectronic component (10, 20)

comprising a housing body (100) with a cavity (110), and comprising an optical element (300) with an outer surface (380) ,

wherein the optical element (300) is arranged on the housing body (100) such that the outer surface (380) faces a side wall (140) of the cavity (110) .

21. he optoelectronic component (10, 20) according to claim 20,

wherein the optical element (300) comprises an optical lens (330),

wherein the optical lens (330) extends into the cavity (110) ,

wherein the optical lens (330) comprises the outer surface (380) .

22. The optoelectronic component (10, 20) according to one of claims 20 and 21,

wherein the optical lens (330) is asymmetric.

23. The optoelectronic component (10, 20) according to one of claims 20 to 22,

wherein an optoelectronic semiconductor chip (500) is arranged in the cavity (110),

wherein light emitted by the optoelectronic semiconductor chip (500) is at least partially coupled into the optical element (300) and is at least partially reflected by total internal reflection on the outer surface (380) .