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1. (WO2008089401) FLEXIBLE TRANSPARENT ELECTRODES VIA NANOWIRES AND SACRIFICIAL CONDUCTIVE LAYER
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We Claim:

1. A flexible assembly comprising a flexible substrate and a patterned layer formed over the flexible substrate, wherein the patterned layer comprises a conducting oxide layer and a second conductive layer comprising a plurality of conductive nanowires formed directly on the conducting oxide layer, wherein the patterned layer has a line spacing of about 500 nm to about 25 μm.
2. The flexible assembly of claim 1, wherein the conducting oxide layer has a thickness less than about 500 A.
3. The flexible assembly of claim 2, wherein the conducting oxide layer has a thickness ranging from about 50 A to about 200 A.
4. The flexible assembly of any one of claims 1 - 3, wherein the conducting oxide layer comprises a transparent conducting oxide.
5. The flexible assembly of claim 4, wherein the transparent conducting oxide comprises a doped indium oxide, a doped zinc oxide, antimony tin oxide, cadmium stannate, zinc stannate, or mixtures thereof.
6. The flexible assembly of claim 5, wherein the transparent conducting oxide comprises indium tin oxide.
7. The flexible assembly of any one of claims 1 - 6, wherein the conductive nanowires comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, or mixtures thereof.
8. The flexible assembly of any one of claims 1 - 7, wherein the flexible substrate comprises polyethylene naphthalate, polyimide, polyethersulfone, polyurethane, polycarbonate, or mixtures thereof.
9. The flexible assembly of any one of claims 1 - 8, further comprising a plurality of liquid crystal cells formed over the second conductive layer.
10. The flexible assembly any one of claims 1 - 9, further comprising a plurality of organic light emitting diodes, electrowetting light valves, electrophoretic pixels, or combinations thereof, formed over the second conductive layer.
11. The flexible assembly of any one of claims 1 - 10 , where the flexible assembly is transparent.
12. A flexible display, comprising the flexible assembly of any one of claims 1 - 11.

13. A method of fabricating a patterned flexible substrate comprising: providing a flexible substrate having a patterned layer comprising a conducting oxide layer formed over at least one surface of the substrate;
forming a second conductive layer comprising conductive nanowires directly on the conducting oxide layer wherein the patterned layer has a line spacing of less than about 25 μm .
14. The method of claim 13, wherein forming the second conductive layer comprises providing a medium comprising binding salts and the conductive nanowires;
immersing the flexible substrate in the medium; and
applying a voltage across the conducting oxide layer and a counter electrode.
15. The method of claim 13, wherein forming the second conductive layer comprises providing a medium comprising the conductive nanowires;
immersing the substrate in the medium; and
providing sonic waves or pressure waves to the medium and immersed substrate.

16. The method of any one of claims 13 - 15, wherein the conducting oxide layer has a thickness less than about 500 A.
17. The method of claim 16, wherein the conducting oxide layer has a thickness ranging from about 50 A to about 200 A.
18. The method of any one of claims 13 - 17, wherein the conducting oxide layer comprises a transparent conducting oxide.
19. The method of claim 18, wherein the transparent conducting oxide comprises a doped indium oxide, a doped zinc oxide, antimony tin oxide, cadmium stannate, zinc stannate, or mixtures thereof.
20. The method of claim 19, wherein the transparent conducting oxide comprises indium tin oxide.
21. The method of any one of claims 13 - 20, wherein the conductive nanowires comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, or mixtures thereof.

22. The method of any one of claims 13 - 21, wherein the flexible substrate comprises polyethylene naphthalate, polyimide, polyethersulfone, polyurethane, polycarbonate, or mixtures thereof.
23. The method of any one of claims 13 -22 , where the flexible substrate is transparent.

24. A method of fabricating a patterned flexible substrate comprising:
providing a flexible substrate having a conducting layer formed over at least one surface of the substrate, wherein the conducting layer comprises a conducting oxide layer formed over the flexible substrate and a second conductive layer comprising conductive nanowires formed directly on the conducting oxide layer,
forming a photoresist layer over the second conductive layer;
patterning and developing the photoresist layer to provide masked and unmasked portions of the conducting layer; and
etching the unmasked portions of the conducting layer to yield a patterned conducting layer comprising the conducting oxide layer and the second conductive layer and having a line spacing of less than about 25 μm.
25. The method of claim 24, wherein the providing a flexible substrate having a conducting layer formed over at least one surface of the substrate comprises
providing a flexible substrate;
forming a conducting oxide layer over the flexible substrate; and
forming a second conductive layer comprising conductive nanowires directly on the conducting oxide layer.
26. The method of claim 25, wherein the conducing oxide layer is formed by sputtering.

27. The method of claim 25 or 26, wherein the second conductive layer is formed by electrophoretic deposition, spray-coating, dip-coating, ink-jet printing, or solution casting of the conductive nanowires from a medium comprising the conductive nanowires onto the conducting oxide layer.
28. The method of any one of claims 24 - 27, wherein the conducting oxide layer has a thickness less than about 500 A.
29. The method of claim 28, wherein the conducting oxide layer has a thickness ranging from about 50 A to about 200 A.
30. The method of any one of claims 24 - 29, wherein the conducting oxide layer comprises a transparent conducting oxide.
31. The method claim 30, wherein the transparent conducting oxide comprises a doped indium oxide, a doped zinc oxide, antimony tin oxide, cadmium stannate, zinc stannate, or mixtures thereof.
32. The method of claim 31, wherein the transparent conducting oxide comprises indium tin oxide.
33. The method of any one of claims 24 - 32, wherein the conductive nanowires comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, or mixtures thereof.

34. The method of any one of claims 24 - 33, wherein the flexible substrate comprises polyethylene naphthalate, polyimide, polyethersulfone, polyurethane, polycarbonate, or mixtures thereof.
35. The method of any one of claims 24 -34 , where the flexible substrate is transparent.