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1. (WO1999035611) SUPPORT ELEMENT FOR A SEMICONDUCTOR CHIP

Pub. No.:    WO/1999/035611    International Application No.:    PCT/DE1998/003622
Publication Date: Fri Jul 16 01:59:59 CEST 1999 International Filing Date: Thu Dec 10 00:59:59 CET 1998
IPC: H01L 21/56
H01L 23/31
H01L 23/495
Applicants: SIEMENS AKTIENGESELLSCHAFT
FISCHER, Jürgen
PÜSCHNER, Frank
HEITZER, Josef
SEIDL, Annemarie
Inventors: FISCHER, Jürgen
PÜSCHNER, Frank
HEITZER, Josef
SEIDL, Annemarie
Title: SUPPORT ELEMENT FOR A SEMICONDUCTOR CHIP
Abstract:
The invention relates to a support element for a semiconductor chip (1), comprising contact tabs (2) punched out of a lead frame and a filling material (4) which is arranged on only one side of the contact tabs (2) and protects both the semiconductor chip (1) and the connecting lines (3) between the chip (1) and the contact tabs (2). Said filling material is linked to at least one of the contact tabs (2), notably by deformation of said contact pad. The deformation is embodied as a tongue (5) which is cut out of the contact pad (2) and is bent away from said contact pad (2) in a plastic manner. Plastic deformation can be replaced by bevelling of at least one of the edges (9) of the tongue facing away from the side of the contact pad (2) facing the filling material.