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1. (WO2005090070) METHOD FOR PRODUCING SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD

Pub. No.:    WO/2005/090070    International Application No.:    PCT/JP2005/005234
Publication Date: Fri Sep 30 01:59:59 CEST 2005 International Filing Date: Thu Mar 24 00:59:59 CET 2005
IPC: B05D 3/02
B05D 7/24
B32B 15/08
H05K 1/03
Applicants: NIPPON STEEL CHEMICAL CO., LTD.
新日鐵化学株式会社
OGAMI, Shuji
大上 修二
KANNO, Masahiro
菅野 勝浩
HIGASAYAMA, Ichiro
日笠山 伊知郎
Inventors: OGAMI, Shuji
大上 修二
KANNO, Masahiro
菅野 勝浩
HIGASAYAMA, Ichiro
日笠山 伊知郎
Title: METHOD FOR PRODUCING SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD
Abstract:
The present invention aims to improve adhesion between a conductor layer and an insulator layer after a heat treatment of a polyimide precursor resin, and to improve variations in adhesion when a long substrate is subjected to a heat treatment. Specifically disclosed is a method for producing a substrate for flexible printed wiring boards having an insulator layer on one side, wherein a polyimide precursor resin solution is directly applied to one surface of a conductor, and then cured by heating after a drying process. This method is characterized in that the highest temperature during the thermal curing is within the range from 300˚C to 400˚C, and the heating temperature is kept within this range for 20-60 minutes.