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1. (WO2019047316) GLUE REMOVING MECHANISM
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№ de pub.: WO/2019/047316 № do pedido internacional: PCT/CN2017/105667
Data de publicação: 14.03.2019 Data de depósito internacional: 11.10.2017
CIP:
B08B 1/00 (2006.01)
B OPERAÇÕES DE PROCESSAMENTO; TRANSPORTE
08
LIMPEZA
B
LIMPEZA EM GERAL; PREVENÇÃO DE SUJEIRAS EM GERAL
1
Limpeza por métodos que exijam essencialmente o uso de ferramentas, escovas ou utensílios semelhantes
Requerentes:
河南裕展精密科技有限公司 HENAN YUZHAN PRECISION TECHNOLOGY CO., LTD. [CN/CN]; 中国河南省郑州市 航空港区振兴路东侧综合保税区B07栋第二、三层 Floor 2/3, Building B07 Comprehensive Bonded Zone East Zhenxing Road, Airport District Zhengzhou, Henan 451162, CN
Inventores:
贾帅 JIA, Shuai; CN
何红应 HE, Hongying; CN
李明权 LI, Mingquan; CN
Mandatário:
深圳市赛恩倍吉知识产权代理有限公司 SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD.; 中国广东省深圳市 龙华新区龙观东路83号荣群大厦9楼 9F, Rongqun Building No.83 Longguan East Rd., Longhua New Dist. Shenzhen, Guangdong 518109, CN
Dados da prioridade:
201721152673.408.09.2017CN
Título (EN) GLUE REMOVING MECHANISM
(FR) MÉCANISME D’ÉLIMINATION DE COLLE
(ZH) 除胶机构
Resumo:
(EN) A glue removing mechanism (100), which is used for removing glue remaining in an electronic device and which comprises a substrate (10); the glue removing mechanism (100) further comprises a plurality of pushing pins (30) that are fixed on the substrate (10), and the substrate (10) is provided thereon with a plurality of fixing holes (12) corresponding to the pushing pins (30), the push pins (30) being inserted into the fixing holes (12) so as to be fixed on the substrate (10); the pushing pins (30) are in contact with an electronic device so as to remove glue remaining in the electronic device.
(FR) La présente invention concerne un mécanisme d’élimination de colle (100), qui est utilisé pour retirer la colle restant dans un dispositif électronique et qui comprend un substrat (10) ; le mécanisme d’élimination de colle (100) comprenant en outre une pluralité de broches de poussée (30) qui sont fixées sur le substrat (10), et le substrat (10) comprend une pluralité de trous de fixation (12) sur ce dernier correspondant aux broches de poussée (30), les broches de poussée (30) étant insérées dans les trous de fixation (12) afin d’être fixées sur le substrat (10) ; les broches de poussée (30) se trouvant en contact avec un dispositif électronique afin de retirer la colle restant dans le dispositif électronique.
(ZH) 一种除胶机构(100),用以除去电子装置中残留的粘胶,包括一基板(10),所述除胶机构(100)还包括若干固定在所述基板(10)上的顶针(30),所述基板(10)上设有若干与所述顶针(30)对应的固定孔(12),所述顶针(30)插入所述固定孔(12)中而固定到所述基板(10)上,所述顶针(30)与所述电子装置接触而除去所述电子装置中残留的粘胶。
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Estados designados: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
Organização Regional Africana da Propriedade Intelectual (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Instituto Eurasiático de Patentes (AM, AZ, BY, KG, KZ, RU, TJ, TM)
Instituto Europeu de Patentes (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
Organização Africana da Propriedade Intelectual (OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Língua de publicação: chinês (ZH)
Língua de depósito: chinês (ZH)