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1. (WO2018160844) COMPUTED TOMOGRAPHY USING INTERSECTING VIEWS OF PLASMA USING OPTICAL EMISSION SPECTROSCOPY DURING PLASMA PROCESSING
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№ de pub.: WO/2018/160844 № do pedido internacional: PCT/US2018/020463
Data de publicação: 07.09.2018 Data de depósito internacional: 01.03.2018
CIP:
A61B 5/00 (2006.01)
A NECESSIDADES HUMANAS
61
CIÊNCIA MÉDICA OU VETERINÁRIA; HIGIENE
B
DIAGNÓSTICO; CIRURGIA; IDENTIFICAÇÃO
5
Medição com finalidades de diagnóstico; Identificação de pessoas
Requerentes:
TOKYO ELECTRON LIMITED [JP/JP]; Akasaka Biz Tower 3-1 Akasaka 5-chome Minato-ku, Tokyo 107-6325, JP
TOKYO ELECTRON U.S. HOLDINGS, INC. [US/US]; 2400 Grove Boulevard Austin, Texas 78741, US (JP)
Inventores:
HAN, Taejoon; US
MORVAY, Daniel; US
VUKOVIC, Mirko; US
Mandatário:
OBLON, Norman F.; US
Dados da prioridade:
15/448,06902.03.2017US
Título (EN) COMPUTED TOMOGRAPHY USING INTERSECTING VIEWS OF PLASMA USING OPTICAL EMISSION SPECTROSCOPY DURING PLASMA PROCESSING
(FR) TOMOGRAPHIE ASSISTÉE PAR ORDINATEUR UTILISANT DES VUES D'INTERSECTION DE PLASMA À L'AIDE D'UNE SPECTROSCOPIE D'ÉMISSION OPTIQUE PENDANT UN TRAITEMENT AU PLASMA
Resumo:
(EN) Described herein are technologies to facilitate computed tomographic techniques to help identifying chemical species during plasma processing of a substrate (e.g., semiconductor wafer) using optical emission spectroscopy (OES). More particularly, the technology described herein uses topographic techniques to spatially resolves emissions and absorptions in at least two-dimension space above the substrate during the plasma processing (e.g., etching) of the substrate. With some implementations utilize optical detectors positioned along multiple axes (e.g., two or more) to receive incident incoming optical spectra from the plasma chamber during the plasma processing (e.g., etching) of the substrate. Because of the multi-axes arrangement, the incident incoming optical spectra form an intersecting grid.
(FR) L'invention concerne des technologies permettant de faciliter des techniques tomographiques assistées par ordinateur pour aider à identifier des espèces chimiques pendant le traitement au plasma d'un substrat (par exemple, une tranche de semi-conducteur) à l'aide d'une spectroscopie d'émission optique (OES). Plus précisément, la technologie de l’invention utilise des techniques topographiques pour résoudre spatialement les émissions et les absorptions dans au moins un espace à deux dimensions au-dessus du substrat pendant le traitement au plasma (par exemple, la gravure) du substrat. Certains modes de réalisation utilisent des détecteurs optiques positionnés le long de multiples axes (par exemple, au moins deux) pour recevoir des spectres optiques entrants incidents provenant de la chambre à plasma pendant le traitement au plasma (par exemple, la gravure) du substrat. Grâce à l'agencement à axes multiples, les spectres optiques entrants incidents forment une grille d'intersection.
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Estados designados: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
Organização Regional Africana da Propriedade Intelectual (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Instituto Eurasiático de Patentes (EAPO) (AM, AZ, BY, KG, KZ, RU, TJ, TM)
Instituto Europeu de Patentes (IEP) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
Organização Africana da Propriedade Intelectual (OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Língua de publicação: Inglês (EN)
Língua de depósito: Inglês (EN)