Pesquisa nas coleções internacionais e nacionais de patentes
Pesquisa nas coleções internacionais e nacionais de patentes |
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| 1. (WO2018042892) ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
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| IPC: | G03F 7/039 C08F 220/28 G03F 7/20 |
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| Applicants: | FUJIFILM CORPORATION 富士フイルム株式会社 |
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| Inventors: | HATAKEYAMA Naoya 畠山 直也 YONEKUTA Yasunori 米久田 康智 FUKUHARA Toshiaki 福原 敏明 TOMIGA Takamitsu 冨賀 敬充 YOSHINO Fumihiro 吉野 文博 |
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| Title: | ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
| Abstract: |
Provided are: an active light sensitive or radiation sensitive resin composition which enables accurate performance evaluation of a resist pattern obtained from a thick resist film; an active light sensitive or radiation sensitive film; a pattern forming method; and a method for manufacturing an electronic device. This active light sensitive or radiation sensitive resin composition contains a resin that has a repeating unit having an alkyleneoxy chain and a repeating unit having an aromatic group, and has a solid content concentration of 10% by mass or more. This pattern forming method has (i) a step for forming an active light sensitive or radiation sensitive film having a film thickness of 1 μm or more on a substrate with use of an active light sensitive or radiation sensitive resin composition which contains a resin that has a repeating unit having an alkyleneoxy chain.
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