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1. WO2017050570 - COOLING ARRANGEMENT FOR AN ELECTRONIC COMPONENT

Número da publicação WO/2017/050570
Data de publicação 30.03.2017
№ do pedido internacional PCT/EP2016/071036
Data do depósito internacional 07.09.2016
CIP
H01L 35/28 2006.01
HELECTRICIDADE
01ELEMENTOS ELÉTRICOS BÁSICOS
LDISPOSITIVOS SEMICONDUTORES; DISPOSITIVOS ELÉTRICOS DE ESTADO SÓLIDO NÃO INCLUÍDOS EM OUTRO LOCAL
35Dispositivos termoelétricos compreendendo uma junção de materiais dissimilares, i.e. apresentando o efeito Seebeck ou o efeito Peltier com ou sem outros efeitos termoelétricos ou termomagnéticos; Processos ou aparelhos especialmente adaptados para a fabricação ou tratamento dos mesmos ou de partes dos mesmos; Detalhes dos mesmos
28funcionando unicamente pelo efeito Peltier ou Seebeck
H01L 23/38 2006.01
HELECTRICIDADE
01ELEMENTOS ELÉTRICOS BÁSICOS
LDISPOSITIVOS SEMICONDUTORES; DISPOSITIVOS ELÉTRICOS DE ESTADO SÓLIDO NÃO INCLUÍDOS EM OUTRO LOCAL
23Detalhes de semicondutores ou outros dispositivos de estado sólido
34Disposições para resfriamento, aquecimento, ventilação ou compensação da temperatura
38Disposições de resfriamento usando o efeito Peltier
H01L 23/467 2006.01
HELECTRICIDADE
01ELEMENTOS ELÉTRICOS BÁSICOS
LDISPOSITIVOS SEMICONDUTORES; DISPOSITIVOS ELÉTRICOS DE ESTADO SÓLIDO NÃO INCLUÍDOS EM OUTRO LOCAL
23Detalhes de semicondutores ou outros dispositivos de estado sólido
34Disposições para resfriamento, aquecimento, ventilação ou compensação da temperatura
46compreendendo a transferência de calor por fluidos em circulação
467por circulação de gases, p. ex. ar
CCP
F04D 25/06
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
DNON-POSITIVE-DISPLACEMENT PUMPS
25Pumping installations or systems
02Units comprising pumps and their driving means
06the pump being electrically driven
F04D 33/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
DNON-POSITIVE-DISPLACEMENT PUMPS
33Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H01L 23/38
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
38Cooling arrangements using the Peltier effect
H01L 23/467
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
467by flowing gases, e.g. air
H01L 35/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
H01L 35/30
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
30characterised by the heat-exchanging means at the junction
Requerentes
  • SIEMENS AKTIENGESELLSCHAFT [DE]/[DE]
Inventores
  • FRANKE, Martin
  • FRÜHAUF, Peter
  • KNOFE, Rüdiger
  • MÜLLER, Bernd
  • NERRETER, Stefan
  • NIEDERMAYER, Michael
  • WITTREICH, Ulrich
  • ZÄSKE, Manfred
Dados da prioridade
10 2015 218 083.221.09.2015DE
Língua de publicação alemão (DE)
Língua do depósito alemão (DE)
Estados designados
Título
(DE) KÜHLANORDNUNG FÜR EINE ELEKTRONISCHE KOMPONENTE
(EN) COOLING ARRANGEMENT FOR AN ELECTRONIC COMPONENT
(FR) DISPOSITIF DE REFROIDISSEMENT POUR UN COMPOSANT ÉLECTRONIQUE
Resumo
(DE)
Kühlanordnung für eine elektronische Komponente Die Erfindung betrifft eine Kühlanordnung für eine elektronische Komponente (11) bzw. eine elektrische Baugruppe mit einer solchen Kühlanordnung. Diese weist zur Kühlung eines elektrischen Bauelements (11) einen passiven Kühlkörper (13) auf. Erfindungsgemäß ist zusätzlich vorgesehen, dass Wandler (14), z. B. thermoelektrische Generatoren, durch Abführung von Wärme aus dem elektronischen Bauelement (11) einen zusätzlichen Kühleffekt bewirken und gleichzeitig die Erzeugung von Energie ermöglichen. Diese kann beispielsweise verwendet werden, um eine aktive Kühlvorrichtung (23) wie einen Piezofächer (38) anzutreiben, der zusätzlich für eine Kühlung des Kühlkörpers (13) sorgt und den Kühleffekt damit verbessert. Das Gesamtsystem ist energieautark, da die erforderliche Energieversorgung aus der Abwärme des elektronischen Bauelements (11) gewonnen wird. Vorteilhaft kann die gewonnene Energie auch anderen Funktionselementen zur Verfügung gestellt werden. Die Mehrkosten der Zusatzkühlung werden daher durch Einsparung einer Energiequelle ausgeglichen.
(EN)
The invention relates to a cooling arrangement for an electronic component (11) or an electrical assembly having such a cooling arrangement. Said cooling arrangement has a passive heat sink (13) for cooling an electrical device (11). According to the invention, there is additionally provision for transducers (14), e.g. thermoelectric generators, to cause an additional cooling effect by dissipating heat from the electronic device (11) and at the same time to allow the generation of power. This can be used, by way of example, to drive an active cooling apparatus (23), such as a piezo fan (38), which additionally caters for cooling the heat sink (13) and hence improves the cooling effect. The overall system is self-sufficient in terms of energy, since the requisite power supply is obtained from the waste heat from the electronic device (11). Advantageously, the power obtained can also be made available to other functional elements. The added costs of the additional cooling are therefore compensated for by saving on an energy source.
(FR)
L'invention concerne un dispositif de refroidissement pour un composant électronique (11) ou pour un sous-ensemble électrique équipé d’un dispositif de refroidissement de ce genre. Ledit dispositif comprend pour le refroidissement d’un composant électronique (11) un corps de refroidissement passif (13). Selon l’invention, ledit dispositif comprend en outre des convertisseurs (14), par exemple des générateurs thermoélectriques, qui provoquent par évacuation de la chaleur dégagée par le composant électronique (11) un effet de refroidissement supplémentaire et permettent en même temps la génération d’énergie. Cette énergie peut être employée par exemple pour entraîner un dispositif de refroidissement actif (23), comme un ventilateur piézoélectrique (38), qui assure en outre un refroidissement du corps de refroidissement (13) et améliore ainsi l’effet de refroidissement. L’ensemble du système est autonome, car l’alimentation nécessaire en énergie est acquise par l’évacuation de chaleur du composant électronique (11). De manière avantageuse, l’énergie acquise peut également être mise à disposition d’autres éléments fonctionnels. Les surcoûts du refroidissement d’appoint sont par conséquent compensés par l’économie d’une source d’énergie.
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