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1. (WO2015126403) LEAD-FREE SOLDER COMPOSITIONS
Dados bibliográficos mais recentes no arquivo da Secretaria Internacional   

№ de pub.: WO/2015/126403 № do pedido internacional: PCT/US2014/017418
Data de publicação: 27.08.2015 Data de depósito internacional: 20.02.2014
CIP:
B23K 35/26 (2006.01)
Requerentes: HONEYWELL INTERNATIONAL INC[US/US]; Patent Services M/S AB/2B 101 Columbia Road P.O. Box 2245 Morristown, New Jersey 07962-2245, US
Inventores: LI, Jianxing; US
PINTER, Michael R.; US
JOHNSON, Vikki L.; US
Mandatário: JACOBSON, Scott; Honeywell International, Inc. 101 Columbia Road P.O. Box 2245 Morristown, NJ 07962-2245, US
Dados da prioridade:
Título (EN) LEAD-FREE SOLDER COMPOSITIONS
(FR) COMPOSITIONS DE SOUDURE EXEMPTE DE PLOMB
Resumo: front page image
(EN) A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
(FR) L'invention concerne une composition de fil métallique de soudure pouvant comprendre entre 85 et 95 % de bismuth et au moins 5 % de cuivre. Cette composition de fil métallique de soudure peut présenter un diamètre inférieur à environ 1 millimètre et un allongement à la rupture d'au moins 20 %
Estados designados: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Instituto Eurasiático de Patentes (AM, AZ, BY, KG, KZ, RU, TJ, TM)
Instituto Europeu de Patentes (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Língua de publicação: inglês (EN)
Língua de depósito: inglês (EN)