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1. (WO2001085840) THERMOSETTING RESINS AND LAMINATES

Pub. No.:    WO/2001/085840    International Application No.:    PCT/US2001/010663
Publication Date: Fri Nov 16 00:59:59 CET 2001 International Filing Date: Tue Apr 03 01:59:59 CEST 2001
IPC: C08F 290/06
C08L 71/12
H05K 1/03
Applicants: GENERAL ELECTRIC COMPANY
Inventors: LANE, Scott, A.
AUSTILL, Timothy, W.
ROLLEN, Donald, C.
CHAO, Herbert, Shin-I
ZARNOCH, Kenneth, Paul
GUO, Hua
PARRILLO, David
REIS, David, Peter
DEVANATHAN, Narsi
DAVID, Benny
Title: THERMOSETTING RESINS AND LAMINATES
Abstract:
Thermosetting polymers and the electrical laminates made therefrom are disclosed. The laminate comprises a cross-linked product of: a) one or more ethylenically unsaturated aromatic monomers, with fire retardation being optionally contributed by one halogenated monomer; b) a vinyl-terminated polybutadiene or butadiene-styrene copolymer containing either a urethane or an ester group; and c) a chemically modified polyphenylene ether resin, preferably low molecular weight chemically modified polyphenylene ether resin. It has been discovered that an unexpected combination of thermal, electrical, and mechanical properties are obtained from the composition recited herein. Therefore, the composition is ideally suited as a matrix polymer for electrical substrate applications.