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1. (WO2015034078) ELECTRONIC-COMPONENT-EQUIPPED SUBSTRATE AND METHOD FOR PRODUCING SAME

Pub. No.:    WO/2015/034078    International Application No.:    PCT/JP2014/073599
Publication Date: Fri Mar 13 00:59:59 CET 2015 International Filing Date: Wed Sep 03 01:59:59 CEST 2014
IPC: H01L 21/52
H01L 23/12
H01L 23/13
H05K 3/32
Applicants: DOWA METALTECH CO., LTD.
DOWAメタルテック株式会社
Inventors: SUNACHI, Naoya
砂地 直也
OSANAI, Hideyo
小山内 英世
KURITA, Satoru
栗田 哲
Title: ELECTRONIC-COMPONENT-EQUIPPED SUBSTRATE AND METHOD FOR PRODUCING SAME
Abstract:
A method for producing an electronic-component-equipped substrate obtained by mounting an electronic component (14) onto one principal surface of a metal plate (10) comprising copper, or (in the case that a copper-plating film (20) is formed on the front surface thereof) aluminum or an aluminum alloy, wherein: a surface treatment causing surface roughness to be 0.4μm or higher is performed by roughening the one principal surface (or the surface having the copper-plating film (20)) (i.e. the surface to which the electronic component (14) is to be mounted) of the metal plate (10); a silver paste is applied to said principal surface (or the surface having the copper-plating film (20)), and the electronic component (14) is positioned thereon; thereafter, a silver bonding layer (12) is formed by sintering the silver in the silver paste; and the electronic component (14) is bonded to the one principal surface (or the surface having the copper-plating film (20)) of the metal plate (10) by the silver bonding layer (12).