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1. (WO2003073520) LIGHT EMITTING DIODE LAMP
Dados bibliográficos mais recentes no arquivo da Secretaria Internacional   

№ de pub.:    WO/2003/073520    № do pedido internacional:    PCT/JP2003/001995
Data de publicação: 04.09.2003 Data de depósito internacional: 24.02.2003
CIP:
H01L 33/60 (2010.01), H01L 33/62 (2010.01)
Requerentes: ROHM CO.,LTD. [JP/JP]; 21, Saiin Mizosaki-cho, Ukyo-ku Kyoto-shi, Kyoto 615-8585 (JP) (For All Designated States Except US).
ISOKAWA, Shinji [JP/JP]; (JP) (For US Only).
YAMAGUCHI, Tomoji [JP/JP]; (JP) (For US Only)
Inventores: ISOKAWA, Shinji; (JP).
YAMAGUCHI, Tomoji; (JP)
Mandatário: ISHII, Akeo; Yachiyo-Building Higashi-Kan Kita 1-21, Tenjinbashi 2-chome Kita-ku, Osaka-shi, Osaka 530-0041 (JP)
Dados da prioridade:
2002-54624 28.02.2002 JP
2002-54625 28.02.2002 JP
2002-106312 09.04.2002 JP
Título (EN) LIGHT EMITTING DIODE LAMP
(FR) LAMPE A DIODE ELECTROLUMINESCENTE
Resumo: front page image
(EN)A light emitting diode lamp comprising a lead terminal (2) provided with a cup (8) having an inner peripheral surface in the form of a conical light reflecting surface (8a), an LED chip (4) die-bonded to the bottom surface (8b) of the cup by a die-bonding agent (H), and a mold (6) of transparent synthetic resin for packaging the portion of the lead terminal that is in the cup, wherein the bottom surface (8b) of the cup is provided either with a recess (9) or with a raised portion (19), to which the LED chip (4) is die-bonded by the die-bonding agent(H), thereby improving optical focusability due to the conical light reflecting surface (8a).
(FR)L'invention concerne une lampe à diode électroluminescente comprenant une borne conductrice (2) comportant une coupelle (8) ayant une surface périphérique interne sous forme d'une surface conique de réflexion de la lumière (8a), une puce LED (4) liée à la surface du fond (8b) de la coupelle au moyen d'un agent de liaison sous pression (H), et un moule (6) de résine synthétique transparente pour l'emballage de la portion de la borne terminale qui est dans la coupelle. La surface du fond (8b) de la coupelle présente soit un évidement (9), soit une portion surélevée (19) à laquelle la puce LED (4) est liée par l'agent de liaison sous pression (H), ce qui permet d'améliorer l'aptitude à la focalisation optique, en raison de la surface conique de réflexion de la lumière (8a).
Estados designados: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Língua de publicação: Japanese (JA)
Língua de depósito: Japanese (JA)