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1. (WO2018120809) CHEMICAL-MECHANICAL POLISHING LIQUID FOR FLATTENING BARRIER LAYER
국제사무국에 기록된 최신 서지정보    정보 제출

공개번호: WO/2018/120809 국제출원번호: PCT/CN2017/094313
공개일: 05.07.2018 국제출원일: 25.07.2017
IPC:
C09G 1/02 (2006.01)
C SECTION C — 화학; 야금
09
염료;페인트;윤기 방편제;천연 수지;접착제;그 밖에 분류되지 않는 조성물;그 밖에 분류되지 않는 재료의 응용
G
프랑스 니스 이외의 광택제 조성물(POLISHING COMPOSITIONS); 스키 왁스(SKI WAXES)
1
광택제 조성물
02
연마제 또는 분쇄제를 포함한 것
출원인:
安集微电子科技(上海)股份有限公司 ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD. [CN/CN]; 中国上海市 浦东新区华东路5001号金桥出口加工区(南区)T6-9幢底层 T6-9, No. 5001, Huadong Road, Shanghai Jinqiao Export Processing Zone (South Zone), Pudong New Area Shanghai 201201, CN
발명자:
潘依君 PAN, Yijun; CN
荆建芬 JING, Jianfen; CN
姚颖 YAO, Ying; CN
杜玲曦 DU, Lingxi; CN
杨俊雅 YANG, Junya; CN
张建 ZHANG, Jian; CN
蔡鑫元 CAI, Xinyuan; CN
宋凯 SONG, Kai; CN
王雨春 WANG, Yuchun; CN
대리인:
北京大成律师事务所 BEIJING DACHENG LAW OFFICES, LLP; 中国上海市 浦东新区银城中路501号上海中心15/16层 15th/16th Floor, Shanghai Tower, 501 Yincheng Road (M), Pudong New Area Shanghai 200120, CN
우선권 정보:
201611231383.928.12.2016CN
발명의 명칭: (EN) CHEMICAL-MECHANICAL POLISHING LIQUID FOR FLATTENING BARRIER LAYER
(FR) LIQUIDE DE POLISSAGE MÉCANO-CHIMIQUE POUR L'APLANISSEMENT DE COUCHE BARRIÈRE
(ZH) 一种用于阻挡层平坦化的化学机械抛光液
요약서:
(EN) The present invention provides a chemical-mechanical polishing liquid for flattening a barrier layer, comprising: abrasive particles, an azole compound, a complexing agent, a nonionic surfactant, and an oxidizing agent. The nonionic surfactant is polyethyleneglycol. The chemical-mechanical polishing liquid has high removal rate for barrier layer and dielectric layer materials under a mild condition, has adjustable removal rate for low dielectric materials and copper, can effectively control generation of dishing, dielectric layer erosion, and metal erosion in the polishing process, can reduce surface contaminants, and therefore has excellent market application prospect.
(FR) La présente invention concerne un liquide de polissage mécano-chimique pour l'aplanissement d'une couche barrière, comportant: des particules abrasives, un composé azole, un agent complexant, un tensioactif non ionique et un agent oxydant. Le tensioactif non ionique est du polyéthylèneglycol. Le liquide de polissage mécano-chimique a un taux d'élimination élevé pour des matériaux de couche barrière et de couche diélectrique dans des conditions douces, possède un taux d'élimination ajustable pour des matériaux à faible constante diélectrique et le cuivre, peut efficacement contrôler la génération de bombage, l'érosion de couche diélectrique et l'érosion métallique lors du processus de polissage, peut réduire des contaminants de surface, et présente par conséquent une excellente perspective d'application de marché.
(ZH) 本发明提供一种用于阻挡层平坦化的化学机械抛光液,其特征在于,包括研磨颗粒、唑类化合物、络合剂、非离子表面活性剂和氧化剂,其中,所述非离子表面活性剂为聚乙二醇。其在较温和的条件下具有高的阻挡层材料、介电层材料去除速率和可调的低介电材料、铜去除速率,并能在抛光过程中很好的控制碟型凹陷(Dishing)、介质层侵蚀(Erosion)、金属腐蚀的产生,以及减少表面污染物。具有优异的市场应用前景。
지정국: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
아프리카지역 지식재산권기구(ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
유라시아 특허청 (AM, AZ, BY, KG, KZ, RU, TJ, TM)
유럽 특허청(EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
공개언어: 중국어 (ZH)
출원언어: 중국어 (ZH)