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1. (WO2018042892) ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Pub. No.:    WO/2018/042892    International Application No.:    PCT/JP2017/025277
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Wed Jul 12 01:59:59 CEST 2017
IPC: G03F 7/039
C08F 220/28
G03F 7/20
Applicants: FUJIFILM CORPORATION
富士フイルム株式会社
Inventors: HATAKEYAMA Naoya
畠山 直也
YONEKUTA Yasunori
米久田 康智
FUKUHARA Toshiaki
福原 敏明
TOMIGA Takamitsu
冨賀 敬充
YOSHINO Fumihiro
吉野 文博
Title: ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Abstract:
Provided are: an active light sensitive or radiation sensitive resin composition which enables accurate performance evaluation of a resist pattern obtained from a thick resist film; an active light sensitive or radiation sensitive film; a pattern forming method; and a method for manufacturing an electronic device. This active light sensitive or radiation sensitive resin composition contains a resin that has a repeating unit having an alkyleneoxy chain and a repeating unit having an aromatic group, and has a solid content concentration of 10% by mass or more. This pattern forming method has (i) a step for forming an active light sensitive or radiation sensitive film having a film thickness of 1 μm or more on a substrate with use of an active light sensitive or radiation sensitive resin composition which contains a resin that has a repeating unit having an alkyleneoxy chain.