국제 및 국내 특허문헌 검색

1. (WO2018034887) LOW STRESS PACKAGING DESIGN TO MINIMIZE PELLET BLOCKING

Pub. No.:    WO/2018/034887    International Application No.:    PCT/US2017/045902
Publication Date: Fri Feb 23 00:59:59 CET 2018 International Filing Date: Wed Aug 09 01:59:59 CEST 2017
IPC: B65D 71/06
B65D 19/06
Applicants: DOW GLOBAL TECHNOLOGIES LLC
Inventors: DHODAPKAR, Shrikant
GRAVOUILLA, Rocklyn, P.
BELLEFONTAINE, William, B.
BUENO, Fernanda, Bortolane
Title: LOW STRESS PACKAGING DESIGN TO MINIMIZE PELLET BLOCKING
Abstract:
Packaging configuration comprising: a pallet comprising a top surface, a bottom surface and a height HP; a first stack of bagged goods having a total height HL1, stacked on the pallet and comprising at least two layers; and a support structure comprising at least four walls situated over the first stack of bagged goods, one of the walls being a top wall and at least three of the walls being sidewalls. The support structure has a height HC that meets one of the following equations: HC > HL1, when the bottom end of at least one sidewall of the support structure is positioned on the top surface of the at least one pallet; or HC > HP + HL1, when the bottom end of at least one sidewall of the support structure and the bottom surface of the pallet are both positioned on the same surface. An air gap having a height HAG is situated between a top layer of the first stack of bagged goods and the top wall of the support structure.