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1. (CN103942538) Fingerprint recognition sensor encapsulation structure

특허청 : 중국
출원번호: 201410138281.7 출원일: 04.04.2014
공개번호: 103942538 공개일: 23.07.2014
특허번호: 103942538 특허부여일: 06.06.2017
공개유형: B
IPC:
G06K 9/00
G SECTION G — 물리학
06
산술논리연산; 계산; 계수
K
데이터의 인식; 데이터의 표시; 기록매체; 기록매체의 취급
9
인쇄문자, 손으로 쓴 문자를 독취하거나 인식 또는 패턴을 인식하기 위한 방법 또는 장치, 예. 지문인식
출원인: 南昌欧菲生物识别技术有限公司
南昌欧菲光科技有限公司
深圳欧菲光科技股份有限公司
苏州欧菲光科技有限公司
발명자: 刘隆主
杜东阳
白安鵬
蔡美雄
대리인: 广州三环专利代理有限公司 44202
广州三环专利代理有限公司 44202
우선권 정보
발명의 명칭: (EN) Fingerprint recognition sensor encapsulation structure
(ZH) 指纹识别传感器封装结构
요약서: front page image
(EN) The invention discloses a fingerprint recognition sensor encapsulation structure which comprises an outer frame, a chip, a touch panel and a metal ring. The outer frame is provided with a window, the touch panel is mounted at the position of the window of the outer frame, the chip is arranged on one side of the inner surface of the touch panel, the metal ring is arranged on the outer surface of the touch panel in a protruding mode and is electrically connected to the chip, the touch panel comprises a fingerprint induction area, the metal ring is located on the outer edge of the fingerprint induction area and comprises an inner side face, an outer side face and a top face, the inner side face is adjacent to the fingerprint induction area, the outer side face faces the outer frame, the top face is connected between the inner side face and the outer side face, and fingers make contact with the fingerprint induction area and are capable of making contact with the inner side face and the top face at the same time. According to the fingerprint recognition sensor encapsulation structure, signals transmitted to the fingerprint induction area through the metal ring and the fingers are small in attenuation, and therefore fingerprint images inducted by the chip are made clear.
(ZH) 本发明公开了一种指纹识别传感器封装结构,包括外框、芯片、接触面板及金属环,所述外框设有开窗,所述接触面板安装于所述外框之所述开窗处,所述芯片设置于所述接触面板的内表面的一侧,所述金属环突设于所述接触面板的外表面,且所述金属环电连接至所述芯片,所述接触面板包括指纹感应区,所述金属环位于所述指纹感应区的外边缘处,所述金属环包括内侧面、外侧面和顶面,所述内侧面邻接所述指纹感应区,所述外侧面面对所述外框,所述顶面连接于所述内侧面和所述外侧面之间,手指接触所述指纹感应区的同时能够接触所述内侧面和所述顶面。本发明提供的指纹识别传感器封装结构通过金属环及手指传送至指纹感应区的信号衰减小,使得所述芯片感应到的指纹影像清晰。