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1. (US20100163292) Package carrier

官庁 : アメリカ合衆国
出願番号: 12483261 出願日: 12.06.2009
公開番号: 20100163292 公開日: 01.07.2010
特許番号: 08130509 特許付与日: 06.03.2012
公報種別: B2
IPC:
H05K 7/10
H01R 12/04
H 電気
05
他に分類されない電気技術
K
印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
7
異なる型の電気装置に共通の構造的細部
02
支持装置上の回路素子または配線の配置
10
回路素子のプラグ―インによる組み立て
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
02
Structural associations of a plurality of mutually-insulated electrical connecting elements
04
specially adapted for rigid printed circuits
出願人: Industrial Technology Research Institute
発明者: Tsai Tsung-Fu
Zhan Chau-Jie
Chang Jing-Yao
Chang Tao-Chih
代理人: Jianq Chyun IP Office
優先権情報: 97151845 A 31.12.2008 TW
発明の名称: (EN) Package carrier
要約: front page image
(EN)

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.