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1. KR1020150128577 - SUPPORT SEPARATING METHOD

パーマリンク
官庁 大韓民国
出願番号 1020150063000
出願日 06.05.2015
公開番号 1020150128577
公開日 18.11.2015
特許番号 1018119200000
特許付与日 22.12.2017
公報種別 B1
IPC
H01L 21/78
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
701つの共通基板内または上に形成された複数の固体構成部品または集積回路からなる装置またはその特定部品の製造または処理;集積回路装置またはその特定部品の製造
771つの共通基板内または上に形成される複数の固体構成部品または集積回路からなる装置の製造または処理
78複数の別個の装置に基板を分割することによるもの
H01L 21/683
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
67製造または処理中の半導体または電気的固体装置の取扱いに特に適用される装置;半導体または電気的固体装置もしくは構成部品の製造または処理中のウエハの取扱いに特に適用される装置
683支持または把持のためのもの
CPC
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
B32B 37/02
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
02characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
B32B 38/10
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
38Ancillary operations in connection with laminating processes
10Removing layers, or parts of layers, mechanically or chemically
B32B 38/1858
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
38Ancillary operations in connection with laminating processes
18Handling of layers or the laminate
1858using vacuum
B32B 43/006
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
43Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
006Delaminating
B32B2037/268
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
14characterised by the properties of the layers
26with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
268Release layers
出願人 도오꾜오까고오교 가부시끼가이샤
도오꾜오까고오교 가부시끼가이샤
発明者 이와타 야스마사
이와타 야스마사
이나오 요시히로
이나오 요시히로
나카무라 아키히코
나카무라 아키히코
다카세 신지
다카세 신지
요시오카 다카히로
요시오카 다카히로
代理人 특허법인코리아나
특허법인코리아나
優先権情報 JP-P-2014-097142 08.05.2014 JP
2015039478 27.02.2015 JP
発明の名称
(EN) SUPPORT SEPARATING METHOD
(KO) 지지체 분리 방법
front page image
要約
(EN)
(Subject) the present invention prevents damage to a substrate when the substrate and a support are separated. (Solution) a deposition body (10) is formed by depositing a substrate (1) and a support plate (2) through an adhesive layer (3). The method includes a preliminary processing step of reducing adhesive force of at least one part of a separation layer (4), formed in at least one part of an edge part of a surface of the substrate (1), facing the support plate (2), or formed in at least one part of an edge part of a surface of the support plate (2), facing the substrate (1); and a separation step of fixing a part of the support plate (2) and the substrate (1) after the preliminary processing step, and separating the support plate (2) from the substrate (1) by applying force to the other side. COPYRIGHT KIPO 2016

(KO)
(과제) 기판과 지지체를 분리시킬 때에 기판이 파손되는 것을 방지한다. (해결 수단) 기판 (1) 과 서포트 플레이트 (2) 가 접착층 (3) 을 개재하여 적층되어 이루어지는 적층체 (10) 에 있어서, 기판 (1) 에 있어서의 서포트 플레이트 (2) 에 대향하는 측의 면에 있어서의 주연 부분의 적어도 일부, 또는 서포트 플레이트 (2) 에 있어서의 기판 (1) 에 대향하는 측의 면에 있어서의 주연 부분의 적어도 일부에 형성된 분리층 (4) 의 적어도 일부의 접착력을 저하시키는 예비 처리 공정과, 예비 처리 공정 후, 기판 (1) 및 서포트 플레이트 (2) 중 일부를 고정시키고, 타방에 힘을 가함으로써 기판 (1) 으로부터 서포트 플레이트 (2) 를 분리시키는 분리 공정을 포함한다.
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