(EN) PROBLEM TO BE SOLVED: To make it possible to easily manufacture a circuit substrate out of a plastic substrate, which lacks strength and stiffness, though, as a simple substance.
SOLUTION: An adhesive material is applied or pasted onto a support substrate to form an adhesion material layer, adhesive strength control treatment is selectively done on the adhesion material layer to form two regions in the adhesion material layer, a region with weakly adhesive force and a region with strongly adhesive force having stronger adhesive force than the region with weakly adhesive force, a plastic substrate is pressure-bonded to the adhesive material layer provided with multi-adhesion regions in an environment with vacuum of 300Torr or less, circuitry is formed on a surface opposite to that of the plastic substrate pressure-welded to the adhesion material layer, and within a region corresponding to right above the region with weakly adhesive force, and the region of the plastic substrate in which the circuitry has been formed is cut out regarding the region with weakly adhesive force of the adhesion material layer as a release layer, thus obtaining a circuit substrate having circuitry on a plastic substrate.
COPYRIGHT: (C)2007,JPO&INPIT
(JA) 【課題】単体では強度や剛性が不足しているプラスチック基板であっても回路基板を簡便に製造することができるようにする。
【解決手段】支持基板上に粘着材を塗布または貼付して該支持基板上に粘着材層を形成し;前記粘着材層に対し粘着力制御処理を選択的に施し、前記粘着材層中に弱粘着力領域と該弱粘着力領域よりも粘着力が強い強粘着力領域の少なくとも2つの領域を形成し;複数の粘着力領域が設けられた前記粘着材層に対し、プラスチック基板を真空度300Torr以下の環境下で圧着し;前記粘着材層に圧接した前記プラスチック基板の面とは反対側の面上であって、前記弱粘着力領域の直上に相当する領域内に回路を形成し;前記回路を形成したプラスチック基板の領域を、前記粘着材層の弱粘着力領域を剥離層として切り出し、プラスチック基板上に回路を有する回路基板を得る。
【選択図】なし