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1. CN1756720 - Silica fine particles

官庁 中華人民共和国
出願番号 200380110022.3
出願日 25.12.2003
公開番号 1756720
公開日 05.04.2006
特許番号 100569642
特許付与日 16.12.2009
公報種別 C
IPC
C01B 33/18
C化学;冶金
01無機化学
B非金属元素;その化合物
33けい素;その化合物
113酸化けい素;その水和物
12シリカ;その水和物,例.うろこ状けい酸
18ゾル状でもゲル状でもない微粉状のシリカの製造;その後処理
C08K 3/36
C化学;冶金
08有機高分子化合物;その製造または化学的加工;それに基づく組成物
K無機または非高分子有機物質の添加剤としての使用(ペイント,インキ,ワニス,染料,艶出剤,接着剤C09)
3無機物質の添加剤としての使用
34けい素含有化合物
36シリカ
C09C 1/30
C化学;冶金
09染料;ペイント;つや出し剤;天然樹脂;接着剤;他に分類されない組成物;他に分類されない材料の応用
C顔料または充てん剤の性質を改良するための,繊維性充てん剤以外の無機物質の処理;カーボンブラックの製造
1繊維性充てん剤以外の特定の無機物質の処理;カーボンブラックの製造
28けい素化合物
30けい酸
G03G 9/08
G物理学
03写真;映画;光波以外の波を使用する類似技術;電子写真;ホログラフイ
Gエレクトログラフィー;電子写真;マグネトグラフィー
9現像剤
08トナー粒子をもつもの
CPC
B82Y 30/00
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
30Nanotechnology for materials or surface science, e.g. nanocomposites
C01B 33/183
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; ; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
33Silicon; Compounds thereof
113Silicon oxides; Hydrates thereof
12Silica; Hydrates thereof, e.g. lepidoic silicic acid
18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
181by a dry process
183by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
C01P 2004/54
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2004Particle morphology
54Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
C01P 2004/62
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2004Particle morphology
60Particles characterised by their size
62Submicrometer sized, i.e. from 0.1-1 micrometer
C01P 2004/64
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2004Particle morphology
60Particles characterised by their size
64Nanometer sized, i.e. from 1-100 nanometer
C01P 2006/12
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2006Physical properties of inorganic compounds
12Surface area
出願人 Tokuyama Corp.
株式会社德山
発明者 Ohara Masakazu
大原雅和
Kimura Minoru
木村稔
Aoki Hiroo
青木博男
代理人 fan chi zhao sulin
中国专利代理(香港)有限公司
中国专利代理(香港)有限公司
優先権情報 380774/2002 27.12.2002 JP
発明の名称
(EN) Silica fine particles
(ZH) 细二氧化硅颗粒
要約
(EN)
Silica fine particles which can be obtained by a reaction in a flame and have an average particle size of 0.05-1 mum, characterized in that a fractal shape parameter alpha1 within an analyzing range of 50 nm-150 nm and a fractal shape parameter alpha2 within an analyzing range of 150 nm-353 nm when measured by a small-angle X-ray scattering satisfy the conditions shown by the following expressions (1) and (2) -0.0068S + 2.548 <= ALPHA1 <= -0.0068S + 3.748 (1) -0.0011S + 1.158 <= ALPHA2 <= -0.0011S + 2.058 (2), where S in the expressions (1) and (2) denotes the BET specific surface area (m<2>/g) of silica fine particles. The silica fine particles can be highly compactly filled without increasing viscosity when they are used as a filling material for semiconductor sealing resin, as well as used as an abrasive and a filling material for an ink jet sheet coat layer or the like, can favorably express strength in an obtained molding when used as a resin filler, and can impart a good fluidity to toner and deliver a good coming-off preventing feature to toner resin particles when used as an electrophotographic toner external additive.

(ZH)

可通过在火焰中反应得到并且平均粒度为0.05-1μm的细二氧化硅颗粒,特征在于当通过小角度X-射线散射测量时,在50nm-150nm分析范围内的分形参数α1和在150nm-353nm分析范围内的分形参数α2满足下面的表达式(1)和(2)所示的条件:-0.0068S+2.548≤α1≤-0.0068S+3.748(1),-0.0011S+1.158≤α2≤-0.0011S+2.058(2),其中表达式(1)和(2)中的S表示二氧化硅细颗粒的BET比表面积(m2/g)。当它们用作半导体密封树脂用填充材料时,以及用作磨料和喷墨纸涂层等的填充材料时,可被高度压实填充而不增加粘度,当用作树脂填料时可有利地在得到的模型中展现强度,当用作静电复制调色剂外添加剂时,可赋予调色剂良好的流动性和为调色剂树脂颗粒提供良好的防脱落特性。