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1. (CN101883658) Method for machining material using laser radiation and apparatus for carrying out the method

官庁 : 中華人民共和国
出願番号: 200880100360.1 出願日: 23.05.2008
公開番号: 101883658 公開日: 10.11.2010
特許番号: 101883658 特許付与日: 21.08.2013
公報種別: B
PCT 関連事項: 出願番号:PCTEP2008004127 ; 公開番号:2008145305 クリックしてデータを表示
IPC:
B23K 26/06
B 処理操作;運輸
23
工作機械;他に分類されない金属加工
K
ハンダ付またはハンダ離脱;溶接;ハンダ付または溶接によるクラッドまたは被せ金;局部加熱による切断,例.火炎切断:レーザービームによる加工
26
レーザービームによる加工,例.溶接,切断,穴あけ
02
加工物の位置決めまたは観察,例.照射点に関するもの;レーザービームの軸合せ,照準,焦点合せ
06
レーザービーム光の成形,例.マスクまたは多焦点装置によるもの
CPC:
B23K 26/381
B23K 26/0604
B23K 26/0617
B23K 26/382
B23K 26/384
B23K 26/386
B23K 26/385
出願人: 弗劳恩霍弗实用研究促进协会
発明者: D·佩特林
F·施奈德
W·舒尔茨
M·尼森
代理人: 中国专利代理(香港)有限公司 72001
優先権情報: 102007024700.3 25.05.2007 DE
発明の名称: (EN) Method for machining material using laser radiation and apparatus for carrying out the method
(ZH) 用于用激光辐射进行材料加工的方法以及用于实施所述方法的装置
要約: front page image
(EN) The invention relates to a method for machining material using laser radiation, in which the unfocused laser radiation is focused through a focusing optics to a smaller beam cross section, the optical axis of the focused laser radiation, referred to as beam axis, is directed at the material surface, the beam waist, which results from the focusing operation, of the focused laser radiation is held in the region of the interface, which forms, of laser radiation and material, the laser radiation is partially absorbed on the interface such that due to induced material ablation or induced material displacement the interface and thus also the laser radiation penetrate into the material, wherein the spacing of the beam waist from the upper or lower side of the interface in the axial direction corresponds at most to triple the value of the penetration depth of the interface into the material, which is characterized in that the focusing operation is effected such that components of the laser radiation are made divergent not just in the propagation direction downstream of the beam waist but also in the beam waist and/or also in the propagation direction upstream of the beam waist and are thus directed away from the beam axis, and in that these components and angles of divergence are larger than those of the effects of imaging errors, which are inadvertently produced using standard optics and are tolerated. The invention furthermore relates to an apparatus for carrying out the method.
(ZH)

本发明涉及一种用于用激光辐射进行材料加工的方法,其中未聚焦的激光辐射通过聚焦光学器件聚焦到较小的辐射横截面上,经过聚焦的激光辐射的称为射束轴线的光学轴线指向材料表面,经过聚焦的激光辐射的从聚焦中产生的射束收缩部保持在由激光辐射与材料所构成的相互作用面的区域中,激光辐射在相互作用面上部分地被吸收,使得所述相互作用面通过所诱发的材料侵蚀或者所诱发的材料挤出并且由此也通过激光辐射侵入到材料中,其中所述射束收缩部距所述相互作用面的上侧面或者下侧面的沿轴向方向的间距最大相当于所述相互作用面在材料中的侵入深度的三倍的数值,其特征在于,如此进行聚焦,使得激光辐射的不仅沿传播方向在射束收缩部后面的份额而且在射束收缩部中的份额和/或沿传播方向在射束收缩部前面的份额发散并且由此偏离射束轴线,并且这些份额和发散角大于那些用标准光学器件无意产生并且要堪于忍受的成像缺陷影响的份额和发散角。此外,本发明涉及一种用于实施所述方法的装置。


また、:
EP2152463JP2010527792US20100176102WO/2008/145305