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1. WO2020158621 - ボンディングツールおよびその製造方法、並びにボンディング装置およびボンディング方法

公開番号 WO/2020/158621
公開日 06.08.2020
国際出願番号 PCT/JP2020/002590
国際出願日 24.01.2020
IPC
H01L 21/607 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
50サブグループH01L21/06~H01L21/326の一つに分類されない方法または装置を用いる半導体装置の組立
60動作中の装置にまたは装置から電流を流すためのリードまたは他の導電部材の取り付け
607機械振動,例.超音波振動,の適用を含むもの
CPC
H01L 2224/77315
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
77Apparatus for connecting with strap connectors
7725Means for applying energy, e.g. heating means
773by means of pressure
77313Wedge
77314Shape
77315of the pressing surface, e.g. tip or head
H01L 2224/77316
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
77Apparatus for connecting with strap connectors
7725Means for applying energy, e.g. heating means
773by means of pressure
77313Wedge
77314Shape
77315of the pressing surface, e.g. tip or head
77316comprising protrusions
H01L 2224/77321
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
77Apparatus for connecting with strap connectors
7725Means for applying energy, e.g. heating means
773by means of pressure
77313Wedge
77321Material
H01L 2224/77343
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
77Apparatus for connecting with strap connectors
7725Means for applying energy, e.g. heating means
773by means of pressure
77343by ultrasonic vibrations
H01L 2224/84207
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
84using a strap connector
842Applying energy for connecting
84201Compression bonding
84205Ultrasonic bonding
84207Thermosonic bonding
H01L 24/77
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
77Apparatus for connecting with strap connectors
出願人
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP]
発明者
  • 太田 翔一 OTA, Shoichi
  • 三垣 俊二 MIKAKI, Shunji
代理人
  • 特許業務法人ブナ国際特許事務所 BUNA PATENT ATTORNEYS
優先権情報
2019-01210328.01.2019JP
2019-01214928.01.2019JP
2019-01218128.01.2019JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) BONDING TOOL, METHOD FOR MANUFACTURING SAME, BONDING DEVICE, AND BONDING METHOD
(FR) OUTIL DE LIAISON, SON PROCÉDÉ DE FABRICATION, DISPOSITIF DE LIAISON ET PROCÉDÉ DE LIAISON
(JA) ボンディングツールおよびその製造方法、並びにボンディング装置およびボンディング方法
要約
(EN)
The bonding tool according to the present disclosure comprises a main body part and a pressing part connected to the main body part. The pressing part comprises a distal end surface having a plurality of first grooves and a plurality of second grooves intersecting the first grooves, and an inclined surface connecting to the distal end surface. The cutting level difference (Rδc) on the roughness curve of the distal end surface is 0.15 μm to 2 μm, the cutting level difference (Rδc) representing the difference between the cutting level at a 25% load length ratio on the roughness curve and the cutting level at a 75% load length ratio on the roughness curve.
(FR)
L'invention concerne un outil de liaison comprenant une partie de corps principal et une partie de pression raccordée à la partie de corps principal. La partie de pression comprend une surface d'extrémité distale ayant une pluralité de premières rainures et une pluralité de secondes rainures croisant les premières rainures, et une surface inclinée se raccordant à la surface d'extrémité distale. La différence de niveau de coupe (Rδc) sur la courbe de rugosité de la surface d'extrémité distale est de 0,15 µm à 2 µm, la différence de niveau de coupe (Rδc)) représentant la différence entre le niveau de coupe à un rapport de longueur de charge de 25 % sur la courbe de rugosité et le niveau de coupe à un rapport de longueur de charge de 75 % sur la courbe de rugosité.
(JA)
本開示のボンディングツールは、本体部と、該本体部に接続した押圧部とを備え、押圧部は、複数の第1溝および第1溝と交差する複数の第2溝を有する先端面と、先端面に接続する斜面とを備えてなり、先端面の粗さ曲線における25%の負荷長さ率での切断レベルと、粗さ曲線における75%の負荷長さ率での切断レベルとの差を表す、粗さ曲線における切断レベル差(Rδc)が0.15μm~2μmである。
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