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1. (WO2019046333) MICRONEEDLE TREATMENT SYSTEM
注意: このテキストは、OCR 処理によってテキスト化されたものです。法的な用途には PDF 版をご利用ください。

CLAIMS

What is claimed is:

1. A microneedle treatment system, comprising:

a microneedle array attached to a patch, the microneedle array comprising a plurality of fixed-length microneedles, the microneedles comprising an insulated shaft and an uninsulated tip; and

a power supply configured to heat the plurality of microneedles using less than about 2.5 W of power.

2. The system claim 1, wherein the power supply is configured to heat the plurality of microneedles using about 100 mW to about 1000 mW of power.

3. A microneedle treatment system, comprising:

a microneedle array attached to a patch, the microneedle array comprising a plurality of fixed-length microneedles, the microneedles comprising an insulated shaft and an uninsulated tip; and

a power supply configured to heat the plurality of microneedles using about 50 mW of power or less per microneedle.

4. The system of claim 3, wherein the power supply is configured to heat the plurality of microneedles using about 1 mW to about 50 mW of power per microneedle.

5. A microneedle treatment system, comprising:

a patch comprising a dome-shape body comprising a top and a base, and a

microneedle array comprising a plurality of microneedles housed within a cavity within the dome-shaped body and attached to an inner surface of the dome-shaped body, wherein the form of the body can be changed into a substantially flat configuration that results in at least a portion of the microneedles to be repositioned from within the cavity to below the base; and a power supply configured to heat the plurality of microneedles.

6. The system of claim 5, wherein the microneedles are fixed-length microneedles.

7. The system of claim 5 or 6, wherein the microneedles comprising an insulated shaft and an uninsulated tip.

8. The system of any one of claims 5-7, wherein the power supply is configured to heat the plurality of microneedles using less than about 2.5 W of power.

9. The system of claim 8, wherein the power supply is configured to heat the plurality of microneedles using about 100 mW to about 1000 mW of power.

10. The system of any one of claims 5-9, wherein the power supply is configured to heat the plurality of microneedles using about 50 mW of power or less per microneedle.

11. The system of claim 10, wherein the power supply is configured to heat the plurality of microneedles using about 1 mW to about 50 mW of power per microneedle.

12. The system of any one of claims 5-11, wherein the base comprises a lip.

13. The system of any one of claims 5-12, wherein the base or the inner surface comprises an adhesive.

14. The system of any one of claims 1-13, wherein the microneedles are about 2 mm to about 8 mm in length.

15. The system of any one of claims 1-14, wherein the microneedles are about 3 to about 4 mm in length.

16. The system of any one of claims 1-15, wherein the uninsulated tip is about 0.5 mm to about 1.0 mm in length.

17. The system of any one of claims 1-16, wherein the shaft of the microneedles is about 50 μπι to about 500 μπι in diameter.

18. The system of any one of claims 1-17, wherein the plurality of microneedles comprises about 3 microneedles to about 100 microneedles.

19. The system of any one of claims 1-18, wherein the power supply is configured to heat the tips of the microneedles from about 33 °C to about 60 °C.

20. The system of any one of claims 1-19, wherein the plurality of microneedles is heated using a direct current energy.

21. The system of any one of claims 1-19, wherein the plurality of microneedles is heated using a radiofrequency energy.

22. The system of any one of claims 1-21, wherein the system is a hands-free system.

23. The system of any one of claims 1-4 and 14-22, wherein the patch comprises an adhesive.

24. The system of any one of claims 1-4 and 14-23, wherein the patch is crescent-shaped, semi-circular, triangular, square, or rectangular.

25. The system of any one of claims 1-24, wherein the power supply comprises a battery.

26. The system of any one of claims 1-25, wherein the power supply is connected to the microneedle array through a wire.

27. The system of any one of claims 1-26, wherein the power supply is wirelessly connected to the microneedle array.

28. The system of claim 27, wherein the patch comprises a first antenna electrically connected to the microneedle array, wherein the power supply comprises a second antenna, and wherein the power supply powers the microneedle array through inductive power transfer.

29. The system of any one of claims 1-28, comprising a mask comprising the power supply, wherein the mask is configured to be placed over the patch.

30. The system of claim 29, wherein the mask is configured to be placed over, around, or below an eye of a human subject, and over the patch.

31. The system of any one of claims 1-30, wherein the patch or the mask comprises a temperature configured to suspend heating of the microneedles if the temperature goes above a predetermined threshold.

32. The system of any one of claims 1-31, further comprising a telemetry uplink antenna configured to communicate with a computer system or a network.

33. The system of claim 32, wherein the system is operated using the computer system.

34. A method of reducing a subcutaneous fat deposit in a subject, comprising:

inserting a plurality of microneedles into the subject, wherein the tips of the microneedles are positioned within the subcutaneous fat deposit or on the surface of the subcutaneous fat deposit; and

heating the tips of the microneedles using less than about 2.5 W of power, thereby melting fat within the subcutaneous fat deposit.

35. The method of claim 34, wherein heating the tips of the microneedles comprises applying about 100 mW to about 1000 mW of power to the microneedles.

36. A method of reducing a subcutaneous fat deposit in a subject, comprising:

inserting a plurality of microneedles into the subject, wherein the tips of the microneedles are positioned within the subcutaneous fat deposit or on the surface of the subcutaneous fat deposit; and

heating the tips of the microneedles using about 50 mW of power or less per microneedle, thereby melting fat within the subcutaneous fat deposit.

37. The method of claim 36, wherein heating the tips of the microneedles comprises applying about 1 mW to about 50 mW of power per microneedle.

38. A method of reducing a facial fat deposit in a subject, comprising:

inserting a plurality of microneedles into the subject, wherein the tips of the microneedles are positioned within the facial fat deposit or on the surface of the facial fat deposit; and

heating the tips of the microneedles, thereby melting fat within the facial fat deposit.

39. The method of claim 38, wherein the facial fat deposit is a periorbital postseptal fat deposit, a periorbital preseptal fat deposit, or a jowl fat deposit.

40. A method of reducing a subcutaneous fat deposit in a subject, comprising:

positioning a dome-shaped patch comprising a plurality of microneedles on a target skin area above the subcutaneous fat deposit;

reconfiguring the dome-shaped patch into a substantially flat configuration, thereby inserting the tips of the microneedles into the into the subcutaneous fat deposit; and

heating the tips of the microneedles, thereby melting fat within the subcutaneous fat deposit.

41. The method of claim 40, wherein reconfiguring the dome-shaped patch comprises applying pressure to the top of the dome-shaped patch.

42. The method of claim 40 or 41, wherein the target skin area is stretched upon

reconfiguring the dome-shaped patch into the substantially flat configuration.

43. The method of any one of claims 38-42, wherein heating the tips of the microneedles comprises applying less than about 2.5 W of power to the microneedles.

44. The method of claim 43, wherein heating the tips of the microneedles comprises applying about 100 mW to about 500 mW of power to the microneedles.

45. The method of any one of claims 38-44, wherein heating the tips of the microneedles comprises applying about 50 mW of power or less per microneedle.

46. The method of any one of claims 38-45, wherein heating the tips of the microneedles comprises applying about 1 mW to about 50 mW of power per microneedle.

47. The method of any one of claims 34-46, wherein the tips of the microneedles are heated for about 1 minute to about 20 minutes.

48. The method of any one of claims 34-47, wherein heating the tips of the microneedles comprises applying a direct current energy to the microneedles.

49. The method of any one of claims 34-47, wherein heating the tips of the microneedles comprises applying a radiofrequency energy to the microneedles.

50. The system of any one of claims 34-49, wherein the plurality of microneedles comprises about 3 microneedles to about 100 microneedles.

51. The method of any one of claims 34-50, wherein the tips of the microneedles are heated to about 33 °C to about 60 °C.

52. The method of any one of claims 34-51, wherein the microneedles comprise an insulated shaft, and wherein the tips of the microneedles are uninsulated.

53. The method of any one of claims 34-52, comprising attaching a patch comprising the plurality of microneedles to skin above the fat deposit.

54. The method of claim 53, comprising placing a mask over the patch.

55. The method of claim 54, comprising wirelessly transferring energy from the mask to the patch, wherein the transferred energy heats the tips of the microneedles.

56. The method of any one of claims 34-55, comprising controlling the heating of the tips of the microneedles using a computer system.

57. A method of reducing a subcutaneous fat deposit in a subject, comprising:

inserting the plurality of microneedles of the system of any one of claims 1-33 into the subject, wherein the tips of the microneedles are positioned within the subcutaneous fat deposit or on a surface of the subcutaneous fat deposit; and

heating the tips of the microneedles, thereby melting fat within the subcutaneous fat deposit.

58. The method of claim 57, wherein the subcutaneous fat deposit is a subcutaneous facial fat deposit.

59. The method of claim 57 or 58, wherein the subcutaneous fat deposit is a periorbital postseptal fat deposit or a periorbital preseptal fat deposit.

60. An apparatus for monitoring melting of a test substrate, comprising:

a first surface and a second surface, the first surface comprising a transparent region, wherein the first surface and the second surface are parallel;

a middle layer connecting the first surface to the second surface, the middle layer comprising a well containing the test substrate, wherein the test substrate is visible through the transparent region of the first surface, and wherein the well is configured to receive tips of the plurality of microneedles.

61. The apparatus of claim 60, wherein the first surface or the second surface comprises glass or thermally-resistant material.

62. The apparatus of claim 60 or 61, wherein the middle layer comprises a polymeric foam or rubber.

63. The apparatus of any one of claims 60-62, further comprising a device comprising a plurality of microneedles that are inserted in the test substrate or positioned on the surface of the test substrate.

64. The apparatus of claim 63, wherein the microneedles are configured to be heated using a power source.

65. The apparatus of any one of claims 60-64, wherein the transparent region comprises one or more graduated markers for quantitative analysis.

66. The apparatus of any one of claims 60-65, wherein the test substrate is a solid fat.

67. A method of monitoring melting of a test substrate, comprising:

applying energy to a plurality of microneedles inserted into the test substrate using the apparatus of any one of claims 60-66; and

monitoring melting of the test substrate.

68. The method of claim 67, wherein monitoring melting of the test substrate comprises qualitatively determining the degree of melting of the test substrate.

69. The method of claim 67, wherein monitoring melting of the test substrate comprises quantitatively determining the degree of melting of the test substrate.

70. The method of any one of claims 67-69, comprising monitoring the melting of the solid fat at a plurality of different power levels.

71. The method of any one of claims 67-70, comprising monitoring the melting of the solid fat at a plurality of different time points.