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1. WO2017159505 - 半導体装置、金属電極部材および半導体装置の製造方法

公開番号 WO/2017/159505
公開日 21.09.2017
国際出願番号 PCT/JP2017/009296
国際出願日 08.03.2017
IPC
H01R 12/58 2011.01
H電気
01基本的電気素子
R導電接続;互いに絶縁された多数の電気接続要素の構造的な集合体;嵌合装置;集電装置
12印刷回路(例,印刷回路基板(PCB),フラットケーブルもしくはリボンケーブル)または通常は平面構造になっている類似のもの(例,端子片,端子ブロック)に特に適した,複数の相互絶縁された電気接続部材の構造的な集合体;印刷回路,フラットケーブルもしくはリボンケーブル,または通常は平面構造になっている類似のものに特に適した嵌合装置;印刷回路,フラットケーブルもしくはリボンケーブル,または通常は平面構造になっている類似のものとの接触,またはそれらへの挿入に特に適した端子
50固定接続
51剛性の印刷回路または類似の構造物のためのもの
55端子に特徴があるもの
58穴へ挿入するための端子
H01L 23/12 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
12マウント,例.分離できない絶縁基板
H01L 23/48 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
48動作中の固体本体からまたは固体本体へ電流を導く装置,例.リードまたは端子装置
H01R 4/60 2006.01
H電気
01基本的電気素子
R導電接続;互いに絶縁された多数の電気接続要素の構造的な集合体;嵌合装置;集電装置
42個以上の導電部材間の,直接の接触,すなわち互いの接触による導電接続;そのような接触を行い,または保持する手段;導体のための間隔をあけた二つ以上の接続箇所があり,絶縁体を突き刺す接触子を用いる導電接続
58接触する部材の形状または材質に特徴のあるもの
60管状の導体との接続または管状の導体間の接続
H05K 1/18 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
18印刷によらない電気部品と構造的に結合した印刷回路
CPC
H01L 2224/04042
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
04042Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
H01L 2224/291
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
291with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/45124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
45124Aluminium (Al) as principal constituent
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
出願人
  • 富士電機株式会社 FUJI ELECTRIC CO., LTD. [JP]/[JP]
発明者
  • 安達 和哉 ADACHI, Kazuya
代理人
  • 酒井 昭徳 SAKAI, Akinori
優先権情報
2016-05606218.03.2016JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SEMICONDUCTOR DEVICE, METAL ELECTRODE MEMBER AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
(FR) DISPOSITIF À SEMI-CONDUCTEURS, ÉLÉMENT D’ÉLECTRODE MÉTALLIQUE ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF À SEMI-CONDUCTEURS
(JA) 半導体装置、金属電極部材および半導体装置の製造方法
要約
(EN)
In this invention, an open end (1a) of a main body cylinder portion (1) of a cylindrical contact member (10) is joined via a solder (25) onto a conductive plate (22) on an insulated base board. A portion on the other open end (1b) side of the main body cylinder portion (1) of the cylindrical contact member (10) is inserted into a cavity portion (12) of a hollow cylindrical external electrode terminal (11) from an open end (11e) at an end portion (11a) of the external electrode terminal (11). The other end portion (11b) of the external electrode terminal (11) is divided into a plurality of branch portions through cuts provided in a through-hole insertion portion (11c). At each of the branch portions of the through-hole insertion portion (11c) of the external electrode terminal (11), the cylinder surface on the outer side has an arc shape. At each of the branch portions (11d) of the through-hole insertion portion (11c), a pressure is applied by an auxiliary wedge (14) in the direction from the interior to the exterior of the external electrode terminal (11). In this manner, assembly defects accompanying the connection of the external electrode terminal (11) to another member can be eliminated.
(FR)
Dans la présente invention, une extrémité ouverte (1a) d’une partie cylindre de corps principal (1) d’un élément de contact cylindrique (10) est assemblée par l’intermédiaire d’une soudure (25) sur une plaque conductrice (22) sur une carte de base isolée. Une partie sur le côté autre extrémité ouverte (1b) de la partie cylindre de corps principal (1) de l’élément de contact cylindrique (10) est insérée dans une partie cavité (12) d’une borne d’électrode externe cylindrique creuse (11) à partir d’une extrémité ouverte (11e) au niveau d’une partie d’extrémité (11a) de la borne d’électrode externe (11). L’autre partie d’extrémité (11b) de la borne d’électrode externe (11) est divisée en une pluralité de parties branche par l’intermédiaire de découpes ménagées dans une partie d’insertion de trou traversant (11c). Au niveau de chacune des parties branche de la partie d’insertion de trou traversant (11c) de la borne d’électrode externe (11), la surface cylindrique sur le côté externe a une forme d’arc. Au niveau de chacune des parties branche (11d) de la partie d’insertion de trou traversant (11c), une pression est appliquée par un coin auxiliaire (14) dans la direction allant de l’intérieur à l’extérieur de la borne d’électrode externe (11). De cette manière, les défauts d’assemblage accompagnant la connexion de la borne d’électrode externe (11) à un autre élément peuvent être éliminés.
(JA)
絶縁基板の導電性板(22)上に、筒状コンタクト部材(10)の本体筒部(1)の一方の開放端(1a)がはんだ(25)により接合されている。中空筒状の外部電極用端子(11)の空洞部(12)に、外部電極用端子(11)の一方の端部(11a)の開放端(11e)から、筒状コンタクト部材(10)の本体筒部(1)の他方の開放端(1b)側の部分が挿入されている。外部電極用端子(11)の他方の端部(11b)は、スルーホール挿入部(11c)に入れた切り込みにより、複数の枝部に分離されている。外部電極用端子(11)のスルーホール挿入部(11c)の枝部の外側の柱面は円弧形状である。当該スルーホール挿入部(11c)の各枝部(11d)には、補助楔(14)により外部電極用端子(11)の内側から外側に向かう方向に圧力がかかる。このようにすることで、外部電極用端子(11)と他部材との接続に伴う組立て不良をなくすことができる。
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