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1. WO2017158722 - 撮像装置、内視鏡、及び、撮像装置の製造方法

公開番号 WO/2017/158722
公開日 21.09.2017
国際出願番号 PCT/JP2016/058144
国際出願日 15.03.2016
IPC
A61B 1/04 2006.01
A生活必需品
61医学または獣医学;衛生学
B診断;手術;個人識別
1視覚または写真的検査による人体の窩部または管部の内側の診断を行なうための機器,例.内視鏡そのための照明装置
04撮影機またはテレビジョン装置と結合されているもの
CPC
A61B 1/0011
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
BDIAGNOSIS; SURGERY; IDENTIFICATION
1Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes
00064Constructional details of the endoscope body
0011Manufacturing of endoscope parts
A61B 1/04
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
BDIAGNOSIS; SURGERY; IDENTIFICATION
1Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes
04combined with photographic or television appliances
A61B 1/051
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
BDIAGNOSIS; SURGERY; IDENTIFICATION
1Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes
04combined with photographic or television appliances
05characterised by the image sensor, e.g. camera, being in the distal end portion
051Details of CCD assembly
H01L 2224/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
H01L 2224/86947
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
86using tape automated bonding [TAB]
86909Post-treatment of the connector or the bonding area
8693Reshaping
86947by mechanical means, e.g. severing, pressing, stamping
H01L 2224/92175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
92Specific sequence of method steps
921Connecting a surface with connectors of different types
9212Sequential connecting processes
92172the first connecting process involving a TAB connector
92175the second connecting process involving a layer connector
出願人
  • オリンパス株式会社 OLYMPUS CORPORATION [JP]/[JP]
発明者
  • 巣山 拓郎 SUYAMA Takuro
代理人
  • 伊藤 進 ITOH Susumu
優先権情報
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) IMAGE PICKUP DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING IMAGE PICKUP DEVICE
(FR) DISPOSITIF DE CAPTURE D'IMAGES, ENDOSCOPE ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF DE CAPTURE D'IMAGES
(JA) 撮像装置、内視鏡、及び、撮像装置の製造方法
要約
(EN)
An image pickup device 1 is provided with: an image pickup element 10 having wiring 13 that connects a first electrode 12 of a light receiving surface 10SA and a second electrode 14 of a rear surface 10SB to each other; a first wiring board 30 wherein an end surface 30SS, from which a flying lead 31 is protruding, is disposed to face the rear surface 10SB of the image pickup element 10; and a second wiring board 40 wherein an upper surface 30SA of the first wiring board 30 is bonded to a second main surface 40SB, and a leading end surface 40SS is disposed to face the rear surface 10SB. The flying lead 31 is bent and connected to the second electrode 14, and a sealing member 51 sealing a connecting section between the second electrode 14 and the flying lead 31, and a bonding member 52 that bonds the rear surface 10SB and the leading end surface 40SS of the second wiring board 40 to each other are integrally configured using a curable resin 50.
(FR)
Un dispositif de capture d'image 1 comprend : un élément de capture d'image 10 ayant un câblage 13 qui connecte une première électrode 12 d'une surface de réception de lumière 10SA et une seconde électrode 14 d'une surface arrière 10SB l'une à l'autre ; un premier circuit imprimé 30 où une surface d'extrémité 30SS, à partir de laquelle un fil volant 31 est en saillie, est disposée de façon à faire face à la surface arrière 10SB de l'élément de capture d'image 10 ; et un second circuit imprimé 40, où une surface supérieure 30SA du premier circuit imprimé 30 est liée à une seconde surface principale 40SB, et une surface d'extrémité avant 40SS est disposée de façon à faire face à la surface arrière 10SB. Le fil volant 31 est incurvé et connecté à la seconde électrode 14, et un élément d'étanchéité 51 scellant hermétiquement une section de connexion entre la seconde électrode 14 et le fil volant 31, et un élément de liaison 52 qui lie la surface arrière 10SB à la surface d'extrémité avant 40SS de la deuxième carte de câblage 40 l'une à l'autre sont configurés d'un seul tenant à l'aide d'une résine durcissable 50.
(JA)
撮像装置1は、受光面10SAの第1の電極12と裏面10SBの第2の電極14とを接続している配線13を有する撮像素子10と、フライングリード31が突出している端面30SSが撮像素子10の裏面10SBに対して対向配置されている第1配線板30と、第2の主面40SBに第1配線板30の上面30SAが接着されており先端面40SSが裏面10SBに対して対向配置されている第2配線板40と、を具備し、フライングリード31が折り曲げられ第2の電極14と接合されており、第2の電極14とフライングリード31との接合部を封止している封止部材51と、第2配線板40の先端面40SSと裏面10SBとを接着している接着部材52とが一体の硬化型樹脂50により構成されている。
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