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1. WO2017026279 - 支持体分離装置及び支持体分離方法

公開番号 WO/2017/026279
公開日 16.02.2017
国際出願番号 PCT/JP2016/071915
国際出願日 26.07.2016
予備審査請求日 08.06.2017
IPC
H01L 21/02 2006.1
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
H01L 21/683 2006.1
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
67製造または処理中の半導体または電気的固体装置の取扱いに特に適用される装置;半導体または電気的固体装置もしくは構成部品の製造または処理中のウエハの取扱いに特に適用される装置
683支持または把持のためのもの
CPC
B32B 2457/14
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2457Electrical equipment
14Semiconductor wafers
B32B 43/006
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
43Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
006Delaminating
H01L 21/67017
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
H01L 21/6835
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6835using temporarily an auxiliary support
出願人
  • 東京応化工業株式会社 TOKYO OHKA KOGYO CO., LTD. [JP]/[JP]
発明者
  • 岩田 泰昌 IWATA, Yasumasa
代理人
  • 特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK
優先権情報
2015-15925311.08.2015JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SUPPORT BODY SEPARATING DEVICE AND SUPPORT BODY SEPARATING METHOD
(FR) DISPOSITIF DE SÉPARATION DE CORPS DE SUPPORT ET PROCÉDÉ DE SÉPARATION DE CORPS DE SUPPORT
(JA) 支持体分離装置及び支持体分離方法
要約
(EN) In the present invention, a substrate and a support body are separated in a short period of time without any damage when a laminate is separated from a support body. A support body separating device is provided with: a light radiating section (30) for modifying a separation layer in a region (4a) of at least some of the peripheral edge of a separation layer (4) by radiating light onto the region (4a) through a support plate (2); a first holding section (21) for holding and lifting the support plate (2) from the rear surface of the support plate (2), which is a surface opposing the region (4a) where the separation layer (4) has been modified, so as to form a gap between the support plate (2) and the substrate (1), which are laminated with the separation layer (4) modified over the region (4a) interposed therebetween; and a fluid nozzle (40) for ejecting a fluid from the gap to inner portions of the laminate (10) to separate the support plate (2) from the laminate (10).
(FR) La présente invention concerne un substrat et un corps de support qui sont séparés en peu de temps sans aucune détérioration lorsqu'un stratifié est séparé du corps de support. Le dispositif de séparation de corps de support est pourvu : d'une section de rayonnement de lumière (30) permettant de modifier une couche de séparation dans une région (4a) d'au moins une partie du bord périphérique d'une couche de séparation (4) par rayonnement de lumière sur la région (4a) à travers une plaque de support (2); d'une première section de maintien (21) pour maintenir et soulever la plaque de support (2) à partir de la surface arrière de la plaque de support (2), qui est une surface opposée à la région (4a) où la couche de séparation (4) a été modifiée, de manière à former un espace entre la plaque de support (2) et le substrat (1), qui sont stratifiés avec la couche de séparation (4) modifiée sur la région (4a) interposée entre eux; et d'une buse à fluide (40) permettant d'éjecter un fluide depuis l'espace jusqu'aux parties internes du stratifié (10) afin de séparer la plaque de support (2) du stratifié (10).
(JA) 積層体から支持体を分離するときに、基板及び支持体を破損することなく短時間で分離する。支持体分離装置は、分離層(4)における周縁部分の少なくとも一部の領域(4a)に、サポートプレート(2)を介して光を照射することで、当該領域(4a)における分離層を変質させる光照射部(30)と、上記領域(4a)において変質した分離層(4)を介して積層されている基板(1)とサポートプレート(2)との間に隙間を形成するように、サポートプレート(2)における分離層(4)が変質した領域(4a)に対向する面の裏面から、サポートプレート(2)を保持して持ち上げる第一保持部(21)と、積層体(10)からサポートプレート(2)を分離するように、上記隙間から積層体(10)の内部に向かって流体を噴射する流体ノズル(40)とを備えている。
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