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1. (WO2016150080) FLIP CHIP BONDING DEVICE

Pub. No.:    WO/2016/150080    International Application No.:    PCT/CN2015/087199
Publication Date: Fri Sep 30 01:59:59 CEST 2016 International Filing Date: Tue Aug 18 01:59:59 CEST 2015
IPC: H01L 21/603
H01L 21/768
H01L 21/677
H01L 21/683
Applicants: CETC BEIJING ELECTRONIC EQUIPMENT CO.,LTD.
北京中电科电子装备有限公司
Inventors: TANG, Liang
唐亮
YE, Lezhi
叶乐志
ZHOU, Qizhou
周启舟
XU, Pinlie
徐品烈
LANG, Ping
郎平
HUO, Jie
霍杰
LIU, Ziyang
刘子阳
Title: FLIP CHIP BONDING DEVICE
Abstract:
The present disclosure provides a flip chip bonding device, comprising a chip transmission mechanism, the chip transmission mechanism comprising an installation part and a driving part configured to drive the installation part to move, the installation part comprising a plurality of workstations for bearing chips, wherein the chip located on one of the workstations is moved from a first position to a second position through movement of the installation part; a first chip grabbing mechanism, configured to overturn the chips upwards from the lower side after grabbing the chips and putting the chips on the workstations located in the first position on the installation part after overturning the chips; a second chip grabbing mechanism, configured to take out the chips on the workstations located in the second position on the installation part so as to bond. The present disclosure introduces the precise chip transmission mechanism, the reliability is high, and the flip chip bonding device is enabled to be applicable to flip chip bonding of large-scale base materials while not reducing the efficiency, thereby greatly increasing the chip installation accuracy.