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出願の表示

1. WO2015093249 - 配線板

公開番号 WO/2015/093249
公開日 25.06.2015
国際出願番号 PCT/JP2014/081390
国際出願日 27.11.2014
IPC
H05K 1/11 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
11印刷回路への,または印刷回路間の電気的接続のための印刷要素
CPC
H05K 1/0263
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
H05K 1/115
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
115Via connections; Lands around holes or via connections
H05K 2201/0305
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0302Properties and characteristics in general
0305Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
H05K 2201/09509
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09509Blind vias, i.e. vias having one side closed
H05K 2201/0969
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
0969Apertured conductors
H05K 2203/033
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
03Metal processing
033Punching metal foil, e.g. solder foil
出願人
  • 株式会社 豊田自動織機 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI [JP]/[JP]
発明者
  • 郡司 隆宏 GUNJI, Takahiro
  • 尾崎 公教 OZAKI, Kiminori
代理人
  • 恩田 誠 ONDA, Makoto
優先権情報
2013-26269519.12.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) WIRING BOARD
(FR) CARTE DE CÂBLAGE
(JA) 配線板
要約
(EN)
This wiring board (20) comprises an insulating substrate (22), a first metal sheet (31), a second metal sheet (41), and an interlayer connection part (C1). Each metal sheet has a bent section (33, 42) located at least partially inside a through-hole (24) in the insulating substrate (22). The second metal sheet (41) has inspection through-holes (43). Solder (26) that joins the bent sections (33, 42) of the respective metal sheets has spread sections (27) that spread from the inspection through-holes (43) in the radial directions thereof.
(FR)
L’invention porte sur une carte de câblage (20), comprenant un substrat isolant (22), une première couche métallique (31), une deuxième couche métallique (41) et un élément de liaison intercouche (C1). Chaque couche métallique comporte une partie recourbée (33, 42) pénétrant au moins partiellement dans un trou traversant (24) ménagé dans le substrat isolant (22). La deuxième couche métallique (41) comporte des trous traversants d’inspection (43). Une soudure (26) joignant les parties recourbées (33, 42) des couches métalliques respectives comporte des parties en empiètement (27) qui empiètent depuis les trous traversants d’inspection (43) dans leur direction radiale.
(JA)
配線板(20)は、絶縁基板(22)と、第1の金属板(31)と、第2の金属板(41)と、層間接続部(C1)とを含む。両金属板は、絶縁基板(22)の貫通孔{24}内に少なくとも部分的に配置される折曲がり部(33、42)を有する。第2の金属板(41)は、検査用貫通孔(43)を有する。両金属板の折曲がり部(33、42)を接合する半田(26)は、検査用貫通孔(43)から検査用貫通孔(43)の径方向に拡がる拡がり部(27)を有している。
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