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出願の表示

1. WO2015093035 - 基板位置合わせ装置及び基板位置合わせ装置の制御方法

公開番号 WO/2015/093035
公開日 25.06.2015
国際出願番号 PCT/JP2014/006234
国際出願日 15.12.2014
IPC
H01L 21/68 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
67製造または処理中の半導体または電気的固体装置の取扱いに特に適用される装置;半導体または電気的固体装置もしくは構成部品の製造または処理中のウエハの取扱いに特に適用される装置
68位置決め,方向決め,または整列のためのもの
CPC
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
H01L 21/681
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
681using optical controlling means
H01L 21/68707
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68707the wafers being placed on a robot blade, or gripped by a gripper for conveyance
H01L 21/68742
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68742characterised by a lifting arrangement, e.g. lift pins
H01L 21/68764
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68764characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
H01L 21/68792
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68792characterised by the construction of the shaft
出願人
  • 川崎重工業株式会社 KAWASAKI JUKOGYO KABUSHIKI KAISHA [JP]/[JP]
発明者
  • 福島 崇行 FUKUSHIMA, Takayuki
代理人
  • 特許業務法人 有古特許事務所 PATENT CORPORATE BODY ARCO PATENT OFFICE
優先権情報
2013-25876816.12.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SUBSTRATE ALIGNMENT DEVICE AND CONTROL METHOD FOR SUBSTRATE ALIGNMENT DEVICE
(FR) DISPOSITIF D'ALIGNEMENT DE SUBSTRAT ET PROCÉDÉ DE COMMANDE D'UN DISPOSITIF D'ALIGNEMENT DE SUBSTRAT
(JA) 基板位置合わせ装置及び基板位置合わせ装置の制御方法
要約
(EN)
A substrate alignment device (1) is provided with: a plurality of rotating platforms (4) which hold a plurality of substrates horizontally and vertically, and which rotate around an axis; a rotation drive device (2) which synchronizes and rotates the plurality of rotating platforms (4); sensors (13) which detect a notch (90) of each of the substrates held by the plurality of rotating platforms (4); a plurality of supporting claws (50) which support peripheries of the substrates which are upon the rotating platforms (4); supporting claw drive structures (70) which individually move the plurality of supporting claws (50) horizontally between an inward position and an outward position; and raising and lowering devices (30) which raise and lower together the plurality of supporting claw drive structures between a high position and a low position. The substrate alignment device (1), on the basis of positions of each of the notches (90) detected by the sensors (13), causes the rotation drive device (2), the supporting claw drive structures (70), and the raising and lowering devices (30) to perform a predetermined operation including substrate lifting, which lifts only substrates for which alignment has been completed from the rotating platforms, and thereby, positions the notches (90) of the plurality of substrates at a reference rotation angle position.
(FR)
L'invention concerne un dispositif d'alignement de substrat (1) qui comprend : une pluralité de plates-formes rotatives (4) qui supportent horizontalement et verticalement une pluralité de substrats et qui tournent autour d'un axe ; un dispositif d'entraînement en rotation (2) qui synchronise et fait tourner la pluralité de plates-formes rotatives (4) ; des capteurs (13) qui détectent une encoche (90) de chaque substrat supporté par la pluralité de plates-formes rotatives (4) ; une pluralité de griffes de support (50) qui supportent des périphéries des substrats qui se trouvent sur les plates-formes rotatives (4) ; des structures d'entraînement de griffe de support (70) qui déplacent individuellement et horizontalement la pluralité de griffes de support (50) entre une position intérieure et une position extérieure ; et des dispositifs de levage et d'abaissement (30) qui lèvent et abaissent conjointement la pluralité de structures d'entraînement de griffe de support entre une position haute et une position basse. Sur la base des positions de chaque encoche (90) détectée par les capteurs (13), le dispositif d'alignement de substrat (1) amène le dispositif d'entraînement en rotation (2), les structures d'entraînement de griffe de support (70) et les dispositifs de levage et d'abaissement (30) à effectuer une opération prédéterminée, y compris un levage de substrat qui soulève seulement les substrats pour lesquels un alignement a été réalisé depuis les plates-formes rotatives et, de ce fait, positionne les encoches (90) de la pluralité de substrats à une position d'angle de rotation de référence.
(JA)
基板位置合わせ装置(1)は、複数枚の基板を水平に且つ上下に保持し、且つ軸線の周りを回転する複数の回転台(4)と、複数の回転台(4)を同期して回転させる回転駆動装置(2)と、複数の回転台(4)に夫々保持される基板のノッチ(90)を検出するセンサ(13)と、回転台(4)上の基板の周縁部を支持する複数の支持爪(50)と、複数の支持爪(50)を内方位置と外方位置との間にて個別に水平移動させる支持爪駆動構造体(70)と、複数の支持爪駆動構造体を高位置と低位置との間にて一括で昇降させる昇降装置(30)とを備える。基板位置合わせ装置(1)は、センサ(13)で夫々検出されるノッチ(90)の位置に基づいて回転駆動装置(2)、支持爪駆動駆動構造体(70)及び昇降装置(30)に、位置合わせが済んだ基板のみを前記回転台から持ち上げる基板持ち上げを含む所定の動作をさせることで、複数の基板のノッチ(90)を基準回転角度位置に位置させる。
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