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1. WO2015025693 - めっき装置及びこれを用いたセンサ装置

公開番号 WO/2015/025693
公開日 26.02.2015
国際出願番号 PCT/JP2014/070252
国際出願日 31.07.2014
IPC
C25D 17/08 2006.01
C化学;冶金
25電気分解または電気泳動方法;そのための装置
D電気分解または電気泳動による被覆方法;電鋳;電気分解による加工品の接合;そのための装置
17電解被覆用槽の構造部品またはその組立体
06被覆物品の懸垂または支持装置
08ラック
C23C 18/31 2006.01
C化学;冶金
23金属質材料への被覆;金属質材料による材料への被覆;化学的表面処理;金属質材料の拡散処理;真空蒸着,スパッタリング,イオン注入法,または化学蒸着による被覆一般;金属質材料の防食または鉱皮の抑制一般
C金属質への被覆;金属材料による材料への被覆;表面への拡散,化学的変換または置換による,金属材料の表面処理;真空蒸着,スパッタリング,イオン注入法または化学蒸着による被覆一般
18液状化合物または溶液のいずれかからなる被覆形成化合物の分解による化学的被覆であって表面材料の反応生成物を被覆層中に残さないもの;接触メッキ
16還元または置換によるもの,例.無電解メッキ
31金属による被覆
C25D 21/12 2006.01
C化学;冶金
25電気分解または電気泳動方法;そのための装置
D電気分解または電気泳動による被覆方法;電鋳;電気分解による加工品の接合;そのための装置
21電解被覆用槽の保守または操作方法
12プロセス制御または調整
CPC
C23C 18/1619
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1619Apparatus for electroless plating
C23C 18/163
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1619Apparatus for electroless plating
1628Specific elements or parts of the apparatus
163Supporting devices for articles to be coated
C23C 18/1683
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1675Process conditions
1683Control of electrolyte composition, e.g. measurement, adjustment
C25D 17/00
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
C25D 17/001
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
001Apparatus specially adapted for plating wafers, e.g. semiconductors, solar cells
C25D 17/002
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
002Cell separation, e.g. membranes, diaphragms
出願人
  • 株式会社山本鍍金試験器 YAMAMOTO-MS CO., LTD. [JP/JP]; 東京都渋谷区千駄ヶ谷5丁目28番1号 28-1, Sendagaya 5-chome, Shibuya-ku, Tokyo 1510051, JP
  • 学校法人早稲田大学 WASEDA UNIVERSITY [JP/JP]; 東京都新宿区戸塚町1丁目104番地 104, Totsukamachi 1-chome, Shinjuku-ku, Tokyo 1698050, JP
発明者
  • 山本 渡 YAMAMOTO Wataru; JP
  • 小岩 仁子 KOIWA Kimiko; JP
  • 本間 敬之 HOMMA Takayuki; JP
  • 柳沢 雅広 YANAGISAWA Masahiro; JP
  • 齋藤 美紀子 SAITO Mikiko; JP
  • 山本 智之 YAMAMOTO Tomoyuki; JP
代理人
  • 磯野 道造 ISONO Michizo; JP
優先権情報
2013-16950419.08.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) PLATING APPARATUS AND SENSING DEVICE USING SAME
(FR) APPAREIL DE PLACAGE ET DISPOSITIF DE DÉTECTION L'UTILISANT
(JA) めっき装置及びこれを用いたセンサ装置
要約
(EN)
Provided are: a plating apparatus which is simpler than conventional plating apparatuses and can be easily reduced in size; and a sensing device which uses this plating apparatus. A plating apparatus (1) is provided with: a holding member (2) for holding an object to be plated (W); a spacer (4) which is laminated on the holding member (2) with an annular first sealing member (3) being interposed therebetween, said first sealing member (3) surrounding the object to be plated (W), and which has a penetration part (45) that has the object to be plated (W) exposed therethrough and retains a plating liquid therein; and a positive electrode member (6) which is laminated on the spacer (4) with an annular second sealing member (5) that surrounds the penetration part (45) being interposed therebetween, and which has a positive electrode layer (62) that is arranged so as to face the object to be plated (W) exposed from the penetration part (45).
(FR)
L'invention concerne : un appareil de placage qui est plus simple que des appareils de placage classiques et peut être facilement réduit en taille; et un dispositif de détection qui utilise ce dispositif de plaquage. Un dispositif de placage (1) est pourvu : d'un élément de maintien (2) pour maintenir un objet à revêtir (W); d'une entretoise (4) qui est superposée sur l'élément de maintien (2), un premier élément annulaire d'étanchéité (3) étant interposé entre ces derniers, ledit premier élément d'étanchéité (3) entourant l'objet à revêtir (W), et qui a une partie de pénétration (45) qui a l'objet à revêtir (W) exposé à travers cette dernière et contient un liquide de placage à l'intérieur; et un élément d'électrode positive (6) qui est superposé sur l'entretoise (4), un second élément annulaire d'étanchéité (5) qui entoure la partie de pénétration (45) étant interposé entre ces dernières, et qui a une couche d'électrode positive (62) qui est agencée de manière à faire face à l'objet à revêtir (W) exposé à partir de la partie de pénétration (45).
(JA)
 従来よりも簡素で小型化が容易なめっき装置及びこれを用いたセンサ装置を提供する。めっき装置(1)は、被めっき物(W)を保持する保持部材(2)と、被めっき物(W)を囲う環状の第1シール部材(3)を介して保持部材(2)に積層され、被めっき物(W)を露出させるとともにめっき液を貯留する貫通部(45)を有するスペーサ(4)と、貫通部(45)を囲う環状の第2シール部材(5)を介してスペーサ(4)に積層され、貫通部(45)から露出する被めっき物(W)に対向して配置される陽極層(62)を有する陽極部材(6)と、を備える。
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