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1. WO2015022994 - 放熱回路基板及び電子デバイス

公開番号 WO/2015/022994
公開日 19.02.2015
国際出願番号 PCT/JP2014/071481
国際出願日 15.08.2014
IPC
H01L 23/12 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
12マウント,例.分離できない絶縁基板
H01L 23/36 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
34冷却,加熱,換気または温度補償用装置
36冷却または加熱を容易にするための材料の選択または成形,例.ヒート・シンク
H05K 1/02 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
CPC
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 23/3675
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
3675characterised by the shape of the housing
H01L 23/3735
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
H01L 23/49838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49838Geometry or layout
H01L 23/49894
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49866characterised by the materials
49894Materials of the insulating layers or coatings
H01L 23/562
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
562Protection against mechanical damage
出願人
  • 日本碍子株式会社 NGK INSULATORS, LTD. [JP/JP]; 愛知県名古屋市瑞穂区須田町2番56号 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi 4678530, JP
発明者
  • 谷信 TANI Makoto; JP
  • 田中孔浩 TANAKA Yoshihiro; JP
  • 海老ヶ瀬隆 EBIGASE Takashi; JP
代理人
  • 千葉剛宏 CHIBA Yoshihiro; JP
優先権情報
2013-16926216.08.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) HEAT-RADIATING CIRCUIT BOARD AND ELECTRONIC DEVICE
(FR) CARTE DE CIRCUIT IMPRIMÉ À DISSIPATION DE CHALEUR, ET DISPOSITIF ÉLECTRONIQUE
(JA) 放熱回路基板及び電子デバイス
要約
(EN)
The present invention pertains to a heat-radiating circuit board and an electronic device. The heat-radiating circuit board, which is for a power semiconductor, has: an electrode material (12) to the surface (12a) of which the power semiconductor is mounted; and a member (14) joined to the surface (12a) side of the electrode material (12). The member (14) comprises a material having a large Young's modulus and a lower coefficient of thermal expansion than that of the electrode material (12).
(FR)
L'invention concerne une carte de circuit imprimé à dissipation de chaleur, et un dispositif électronique. La carte de circuit imprimé à dissipation de chaleur qui est destinée à un semi-conducteur de puissance, possède : un matériau d'électrode (12) sur la surface (12a) duquel est monté le semi-conducteur de puissance ; et un élément (14) lié au côté de la surface (12a) du matériau d'électrode (12). L'élément (14) est constitué d'un matériau qui présente un coefficient de dilatation thermique inférieur et un module de Young supérieur à ceux du matériau d'électrode (12).
(JA)
 本発明は、放熱回路基板及び電子デバイスに関する。パワー半導体用の放熱回路基板において、表面(12a)にパワー半導体が実装される電極材(12)と、電極材(12)の表面(12a)側に接合された部材(14)と、を有する。部材(14)は、電極材(12)よりも熱膨張係数が小さく、且つ、ヤング率が大きい材料からなる。
他の公開
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