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1. WO2015022993 - セラミック回路基板及び電子デバイス

公開番号 WO/2015/022993
公開日 19.02.2015
国際出願番号 PCT/JP2014/071473
国際出願日 15.08.2014
IPC
H01L 23/12 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
12マウント,例.分離できない絶縁基板
H01L 23/13 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
12マウント,例.分離できない絶縁基板
13形状に特徴のあるもの
H01L 23/36 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
34冷却,加熱,換気または温度補償用装置
36冷却または加熱を容易にするための材料の選択または成形,例.ヒート・シンク
H05K 1/02 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
CPC
C04B 2237/125
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
2237Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
12Metallic interlayers
125based on noble metals, e.g. silver
C04B 2237/127
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
2237Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
12Metallic interlayers
126wherein the active component for bonding is not the largest fraction of the interlayer
127The active component for bonding being a refractory metal
C04B 2237/368
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
2237Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
32Ceramic
36Non-oxidic
368Silicon nitride
C04B 2237/407
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
2237Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
40Metallic
407Copper
C04B 2237/704
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
2237Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
70Forming laminates or joined articles comprising layers of a specific, unusual thickness
704of one or more of the ceramic layers or articles
C04B 2237/706
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
2237Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
70Forming laminates or joined articles comprising layers of a specific, unusual thickness
706of one or more of the metallic layers or articles
出願人
  • 日本碍子株式会社 NGK INSULATORS, LTD. [JP/JP]; 愛知県名古屋市瑞穂区須田町2番56号 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi 4678530, JP
発明者
  • 谷信 TANI Makoto; JP
  • 田中孔浩 TANAKA Yoshihiro; JP
  • 海老ヶ瀬隆 EBIGASE Takashi; JP
代理人
  • 千葉剛宏 CHIBA Yoshihiro; JP
優先権情報
2013-16926016.08.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) CERAMIC CIRCUIT BOARD AND ELECTRONIC DEVICE
(FR) CARTE DE CIRCUIT IMPRIMÉ EN CÉRAMIQUE, ET DISPOSITIF ÉLECTRONIQUE
(JA) セラミック回路基板及び電子デバイス
要約
(EN)
The present invention pertains to a ceramic circuit board and an electronic device. The present invention has: a ceramic board (12); a first metal plate (14) joined to the surface (12a) of the ceramic board (12); and a member (18) joined to the surface side of the first metal plate (14). The member (18) comprises a material having a high Young's modulus and a lower coefficient of thermal expansion than that of the first metal plate (14).
(FR)
L'invention concerne une carte de circuit imprimé en céramique, et un dispositif électronique. Cette carte de circuit imprimé en céramique possède : un substrat en céramique (12) ; une première plaque métallique (14) liée à une surface (12a) du substrat en céramique (12) ; et un élément (18) lié au côté surface de la première plaque métallique (14). L'élément (18) est constitué d'un matériau qui présente un coefficient de dilatation thermique inférieur et un module de Young supérieur à ceux de la première plaque métallique (14).
(JA)
 本発明は、セラミック回路基板及び電子デバイスに関する。セラミック基板(12)と、該セラミック基板(12)の表面(12a)に接合された第1金属板(14)と、第1金属板(14)の表面側に接合された部材(18)と、を有する。部材(18)は、第1金属板(14)よりも熱膨張係数が小さく、且つ、ヤング率が大きい材料からなる。
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