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1. WO2015019763 - セパレータ付き電子デバイス封止用樹脂シート群及びセパレータ付き電子デバイス封止用樹脂シートの選択方法

公開番号 WO/2015/019763
公開日 12.02.2015
国際出願番号 PCT/JP2014/067800
国際出願日 03.07.2014
IPC
H01L 23/29 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
28封緘,例.封緘層,被覆
29材料に特徴のあるもの
H01L 21/56 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
50サブグループH01L21/06~H01L21/326の一つに分類されない方法または装置を用いる半導体装置の組立
56封緘,例.封緘層,被覆
H01L 23/31 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
28封緘,例.封緘層,被覆
31配列に特徴のあるもの
CPC
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 21/568
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
568Temporary substrate used as encapsulation process aid
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/73204
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73201on the same surface
73203Bump and layer connectors
73204the bump connector being embedded into the layer connector
H01L 24/19
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
18High density interconnect [HDI] connectors; Manufacturing methods related thereto
19Manufacturing methods of high density interconnect preforms
H01L 24/97
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
97the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
出願人
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP/JP]; 大阪府茨木市下穂積1丁目1番2号 1-1-2,Shimohozumi,Ibaraki-shi, Osaka 5678680, JP
発明者
  • 石井 淳 ISHII, Jun; JP
  • 豊田 英志 TOYODA, Eiji; JP
  • 石坂 剛 ISHIZAKA, Tsuyoshi; JP
代理人
  • 特許業務法人 ユニアス国際特許事務所 UNIUS PATENT ATTORNEYS OFFICE; JP
優先権情報
2013-16612609.08.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) GROUP OF SEPARATOR-PROVIDED ELECTRONIC-DEVICE-SEALING RESIN SHEETS, AND METHOD FOR SELECTING SEPARATOR-PROVIDED ELECTRONIC-DEVICE-SEALING RESIN SHEET
(FR) GROUPE DE FEUILLES DE RÉSINE D’ÉTANCHÉITÉ DE DISPOSITIF ÉLECTRONIQUE FOURNIES PAR SÉPARATEUR ET PROCÉDÉ POUR SÉLECTIONNER UNE FEUILLE DE RÉSINE D’ÉTANCHÉITÉ DE DISPOSITIF ÉLECTRONIQUE FOURNIE PAR SÉPARATEUR
(JA) セパレータ付き電子デバイス封止用樹脂シート群及びセパレータ付き電子デバイス封止用樹脂シートの選択方法
要約
(EN)
 Provided are a group of separator-provided electronic-device-sealing resin sheets allowing a desired resin sheet to be easily selected, and a method for selecting a separator-provided electronic-device-sealing resin sheet. The present invention pertains to a group of separator-provided electronic-device-sealing resin sheets in which the separators are differentiated by color according to the thickness or type of the electronic-device-sealing resin sheet. The present invention also pertains to a group of separator-provided electronic-device-sealing resin sheets, including multiple separator-provided electronic-device-sealing resin sheets provided with separators having marks applied according to the thickness or type of the electronic-device-sealing resin sheet.
(FR)
 L’invention porte sur un groupe de feuilles de résine d’étanchéité de dispositif électronique fournies par séparateur permettant à une feuille de résine souhaitée d’être facilement sélectionnée, et sur un procédé de sélection d'une feuille de résine d’étanchéité de dispositif électronique fournie par séparateur. La présente invention concerne un groupe de feuilles de résine d’étanchéité de dispositif électronique fournies par séparateur dans lesquelles les séparateurs sont différenciés par couleur selon l’épaisseur ou le type de la feuille de résine d’étanchéité de dispositif électronique. La présente invention concerne également un groupe de feuilles de résine d’étanchéité de dispositif électronique fournies par séparateur, comprenant de multiples feuilles de résine d’étanchéité de dispositif électronique fournies par séparateur pourvues de séparateurs ayant des marques appliquées selon l’épaisseur ou le type de la feuille de résine d’étanchéité de dispositif électronique.
(JA)
 所望の樹脂シートを容易に選択できるセパレータ付き電子デバイス封止用樹脂シート群及びセパレータ付き電子デバイス封止用樹脂シートの選択方法を提供する。 電子デバイス封止用樹脂シートの厚み又は品種ごとにセパレータが色分けされたセパレータ付き電子デバイス封止用樹脂シート群に関する。また、電子デバイス封止用樹脂シートの厚み又は品種に応じたマークが付されたセパレータを備えるセパレータ付き電子デバイス封止用樹脂シートを複数含むセパレータ付き電子デバイス封止用樹脂シート群に関する。
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