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1. WO2015016270 - 撮像素子搭載用基板及び撮像装置

公開番号 WO/2015/016270
公開日 05.02.2015
国際出願番号 PCT/JP2014/070089
国際出願日 30.07.2014
IPC
H04N 5/225 2006.01
H電気
04電気通信技術
N画像通信,例.テレビジョン
5テレビジョン方式の細部
222スタジオ回路;スタジオ装置;スタジオ機器
225テレビジョンカメラ
H01L 27/14 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
271つの共通基板内または上に形成された複数の半導体構成部品または他の固体構成部品からなる装置
14赤外線,可視光,短波長の電磁波または粒子線輻射に感応する半導体構成部品で,これらの輻射線エネルギーを電気的エネルギーに変換するかこれらの輻射線によって電気的エネルギーを制御するかのどちらかに特に適用されるもの
H04N 5/369 2011.01
H電気
04電気通信技術
N画像通信,例.テレビジョン
5テレビジョン方式の細部
30光または類似信号から電気信号への変換
335固体撮像素子を用いるもの
369固体撮像素子の構造,固体撮像素子と関連する回路に特徴のあるもの
CPC
G02B 27/0006
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
27Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
0006with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
G02B 7/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
H01L 27/14618
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14618Containers
H01L 27/14625
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14625Optical elements or arrangements associated with the device
H04N 5/2253
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
H04N 5/232
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
232Devices for controlling television cameras, e.g. remote control ; ; Control of cameras comprising an electronic image sensor;
出願人
  • 京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
発明者
  • 山田 浩 YAMADA,Hiroshi; JP
  • 春名 大治 HARUNA,Daiji; JP
  • 舟橋 明彦 FUNAHASHI,Akihiko; JP
優先権情報
2013-15786130.07.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SUBSTRATE FOR MOUNTING IMAGING ELEMENT, AND IMAGING DEVICE
(FR) SUBSTRAT DE MONTAGE D'ÉLÉMENT D'IMAGERIE, ET DISPOSITIF D'IMAGERIE
(JA) 撮像素子搭載用基板及び撮像装置
要約
(EN)
[Problem] To provide a substrate for mounting an imaging element, and an imaging device, whereby abrupt changes in air pressure inside the imaging device are inhibited, as is the formation of condensation on the surface of a cover or a lens. [Solution] This substrate (1) for mounting an imaging element has a base (2) that has the following: a through-hole that opens to the top surface of the base (2); a cover mounting region (7) provided around the rim of the through-hole opening in the top surface; a lens-housing mounting region (8) provided on the top surface outside the cover mounting region (7); an intermediate region (6) provided on the top surface between the cover mounting region (7) and the lens-housing mounting region (8); a connecting section (4) that connects the intermediate region (6) to the inside wall of the through-hole; and an imaging-element mounting section (5) provided on the bottom surface of the base (2).
(FR)
Le problème que l'invention cherche à résondre est de fournir un substrat de montage d'un élément d'imagerie, et un dispositif d'imagerie, dans lesquels des modifications brusques de pression d'air à l'intérieur du dispositif d'imagerie sont empêchées, de même que la formation de condensation sur la surface d'un cache ou d'une lentille. La solution de l'invention concerne un substrat (1) de montage d'un élément d'imagerie qui a une base (2) qui comprend les éléments suivants : un trou traversant qui s'ouvre sur la surface supérieure de la base (2) ; une région de montage de cache (7) située autour du bord de l'ouverture du trou traversant dans la surface supérieure ; une région de montage de logement de lentille (8) située sur la surface supérieure à l'extérieur de la région de montage de cache (7) ; une région intermédiaire (6) située sur la surface supérieure entre la région de montage de cache (7) et la région de montage de logement de lentille (8) ; une section de raccord (4) qui raccorde la région intermédiaire (6) à la paroi intérieure du trou traversant ; et une section de montage d'élément d'imagerie (5) située sur la surface inférieure de la base (2).
(JA)
【課題】撮像装置内の気圧の急激な変化を抑制し、蓋体やレンズの表面に結露が生じることを抑制した撮像素子搭載用基板および撮像装置を提供する。 【解決手段】撮像素子搭載用基板1は、基体2を有する撮像素子搭載用基板であって、基体2は、基体2の上面に開口を有する貫通孔と、上面における、貫通孔の開口の周縁に設けられた蓋体搭載領域7と、上面における、蓋体搭載領域7の外側に設けられたレンズ筺体搭載領域8と、上面における、蓋体搭載領域7とレンズ筺体搭載領域8との間に設けられた中間領域6と、中間領域6と貫通孔の内壁とを連通させている連通部4と、基体2の下面に設けられた撮像素子搭載部5と、を有している。
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