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1. WO2015016207 - 異方性導電フィルム及びその製造方法

公開番号 WO/2015/016207
公開日 05.02.2015
国際出願番号 PCT/JP2014/069910
国際出願日 29.07.2014
IPC
H01R 11/01 2006.01
H電気
01基本的電気素子
R導電接続;互いに絶縁された多数の電気接続要素の構造的な集合体;嵌合装置;集電装置
11互いに接続される導電部材用の,間隔をあけた2つ以上の接続箇所を有する個々の接続部材,例.電線またはケーブルによって支持され,かつ,他の電線,端子,導電部材への電気接続を容易にするための手段を備えた,電線またはケーブルのための端子片,締付け端子柱ブロック
01接続位置間の導電相互接続の形状または配列に特徴があるもの
H01L 21/60 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
50サブグループH01L21/06~H01L21/326の一つに分類されない方法または装置を用いる半導体装置の組立
60動作中の装置にまたは装置から電流を流すためのリードまたは他の導電部材の取り付け
H01R 43/00 2006.01
H電気
01基本的電気素子
R導電接続;互いに絶縁された多数の電気接続要素の構造的な集合体;嵌合装置;集電装置
43電線接続器または集電装置の製造,組立,保守または修理のためまたは導体接続のために特に採用される装置または方法
CPC
H01L 2224/27005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
27Manufacturing methods
27001Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
27005for aligning the layer connector, e.g. marks, spacers
H01L 2224/271
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
27Manufacturing methods
271Manufacture and pre-treatment of the layer connector preform
H01L 2224/2711
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
27Manufacturing methods
271Manufacture and pre-treatment of the layer connector preform
2711Shaping
H01L 2224/29018
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
2901Shape
29016in side view
29018comprising protrusions or indentations
H01L 2224/29076
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29075Plural core members
29076being mutually engaged together, e.g. through inserts
H01L 2224/29082
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29075Plural core members
2908being stacked
29082Two-layer arrangements
出願人
  • デクセリアルズ株式会社 DEXERIALS CORPORATION [JP/JP]; 東京都品川区大崎一丁目11番2号 ゲートシティ大崎イーストタワー8階 Gate City Osaki East Tower 8F., 1-11-2, Osaki, Shinagawa-ku, Tokyo 1410032, JP
発明者
  • 猿山 賢一 SARUYAMA Kenichi; JP
  • 阿久津 恭志 AKUTSU Yasushi; JP
代理人
  • 特許業務法人 田治米国際特許事務所 TAJIME & TAJIME; 神奈川県川崎市多摩区三田1-26-28 ニューウェル生田ビル201号室 Room No. 201, New-Well-Ikuta Bldg., 26-28, Mita 1-chome, Tama-ku, Kawasaki-shi, Kanagawa 2140034, JP
優先権情報
2013-15944131.07.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) ANISOTROPICALLY CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR
(FR) FILM À CONDUCTION ANISOTROPE ET SON PROCÉDÉ DE FABRICATION
(JA) 異方性導電フィルム及びその製造方法
要約
(EN)
In this anisotropically conductive film (1A), which has a conductive-particle-array layer (4) in which an insulating resin layer (3) holds a plurality of conductive particles (2) arrayed in a prescribed manner, there is a direction in which the thickness distribution, around the individual conductive particles (2), of the insulating resin layer (3) holding the array of conductive particles is asymmetric with respect to the conductive particles (2). The direction of asymmetry is the same for all of the conductive particles. The use of this anisotropically conductive film (1A) to mount an electronic component can reduce short circuits and conductivity problems.
(FR)
Le film à conduction anisotrope (1A) de l'invention présente une couche à réseau de particules conductrices (4) dans laquelle une couche de résine isolante (3) retient une pluralité de particules conductrices (2) disposées en réseau d'une manière prédéfinie, et présente une direction dans laquelle la distribution de l'épaisseur, autour des particules conductrices individuelles (2) de la couche de résine isolante (3) retenant le réseau de particules conductrices, est asymétrique par rapport aux particules conductrices (2). La direction de l'asymétrie est identique pour toutes les particules conductrices. L'utilisation de ce film à conduction anisotrope (1A) permettant de monter un composant électronique peut réduire les courts-circuits et les problèmes de conductivité.
(JA)
複数の導電粒子(2)が所定の配列で絶縁性樹脂層(3)に保持されている導電粒子配列層(4)を有する異方性導電フィルム(1A)は、導電粒子(2)の配列を保持している絶縁性樹脂層(3)の個々の導電粒子の周囲における厚さ分布が、該導電粒子(2)に対して非対称となる方向を有する。非対称となる方向は、複数の導電粒子について揃っている。この異方性導電フィルム(1A)を用いて電子部品を実装した場合には、ショートや導電不良を低減させることが出来る。
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