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1. WO2015016173 - 配線基板、リード付き配線基板および電子装置

公開番号 WO/2015/016173
公開日 05.02.2015
国際出願番号 PCT/JP2014/069809
国際出願日 28.07.2014
IPC
H05K 3/34 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
30電気部品,例.抵抗器,を印刷回路に取り付けること
32印刷回路に対する電気部品または電線の電気的接続
34ハンダ付けによるもの
H01L 23/12 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
12マウント,例.分離できない絶縁基板
CPC
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 23/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
15Ceramic or glass substrates
H01L 23/498
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
H01L 23/49811
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
H01L 23/49827
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
H01L 23/49866
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49866characterised by the materials
出願人
  • 京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
発明者
  • 乙丸 秀和 OTOMARU,Hidekazu; JP
  • 木村 貴司 KIMURA,Takashi; JP
優先権情報
2013-15678629.07.2013JP
2013-19550920.09.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) WIRING SUBSTRATE, WIRING SUBSTRATE WITH LEAD, AND ELECTRONIC DEVICE
(FR) SUBSTRAT DE CIRCUIT, SUBSTRAT DE CIRCUIT AVEC CONDUCTEUR, ET DISPOSITIF ÉLECTRONIQUE
(JA) 配線基板、リード付き配線基板および電子装置
要約
(EN)
A wiring substrate provided with an insulating substrate (1) made of a ceramic sintered body and a connection pad (2) provided to the surface portion of the insulating substrate. The connection pad includes a first portion (2a) provided to the surface portion of the insulating substrate and a second portion (2b) provided on the first portion, the outer circumference of the second portion (2b) being positioned further inward than the outer circumference of the first portion. The second portion (2b) of the connection pad is made of platinum, and at least an exposed surface section of the first portion (2a) of the connection pad is made of platinum containing a ceramic component. Since the brazing material used when bonding a lead terminal to the connection pad does not readily flow onto the second portion (2b), the outer circumferential part of the brazing material and the outer circumferential part of the connection pad are located at different positions, and problems such as damage to the connection pad caused by a concentration of thermal stress on the outer circumferential part of the connection pad are minimized. In addition, the exposed surface of the connection pad is made of platinum or platinum containing a ceramic component, and therefore does not readily oxidize. An exceptionally heat-resistant wiring substrate or a similar product can thereby be obtained.
(FR)
L'invention concerne un substrat de circuit comportant un substrat isolant (1) constitué d'un corps en céramique fritté et d'une pastille de connexion (2) disposée sur la partie de surface du substrat isolant. La pastille de connexion inclut une première partie (2a) disposée sur la partie de surface du substrat isolant et une seconde partie (2b) disposée sur la première partie, la circonférence extérieure de la seconde partie (2b) étant positionnée plus vers l'intérieur que la circonférence extérieure de la première partie. La seconde partie (2b) de la pastille de connexion est constituée de platine, et au moins une section de surface découverte de la première partie (2a) de la pastille de connexion est constituée de platine contenant un composant en céramique. Puisque le matériau de brasure utilisé pour souder une borne conductrice à la pastille de connexion ne s'écoule pas facilement sur la seconde partie (2b), la partie circonférentielle extérieure du matériau de brasure et la partie circonférentielle extérieure de la pastille de connexion sont situées en des positions différentes, et les problèmes, par exemple de dommages à la pastille de connexion causés par une concentration de contrainte thermique sur la partie circonférentielle de la pastille de connexion, sont minimisés. De plus, la surface dénudée de la pastille de connexion est constituée de platine ou de platine contenant un composant en céramique, et ne s'oxyde donc pas facilement. L'invention permet ainsi d'obtenir un substrat de circuit ou un produit similaire exceptionnellement résistant à la chaleur.
(JA)
 セラミック焼結体からなる絶縁基板(1)と、該絶縁基板の表面部分に設けられた接続パッド(2)とを備えており、接続パッドは、絶縁基板の表面部分に設けられた第1部分(2a)と、第1部分の上に設けられており、外周が第1部分の外周より内側に位置する第2部分(2b)とを含んでおり、接続パッドの第2部分(2b)が白金からなり、接続パッドの第1部分(2a)のうち少なくとも露出する表面部がセラミック成分を含有する白金からなる配線基板である。接続パッドにリード端子が接合されるときのろう材が第2部分(2b)に流れにくいため、ろう材の外周部の位置と接続パッドの外周部の位置とが互いに異なり、接続パッドの外周部への熱応力の集中による接続パッドの破壊等が抑制される。また、接続パッドの露出表面が白金またはセラミック成分を含有する白金からなるため、酸化しにくい。これにより、耐熱性に優れた配線基板等が得られる。
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