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1. WO2015015578 - 電子部品装着装置及び装着方法

公開番号 WO/2015/015578
公開日 05.02.2015
国際出願番号 PCT/JP2013/070679
国際出願日 31.07.2013
IPC
H05K 13/04 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
13電気部品の組立体の製造または調整に特に適した装置または方法
04部品の取り付け
CPC
H05K 13/0404
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
0404Pick-and-place heads or apparatus, e.g. with jaws
H05K 13/046
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
046Surface mounting
H05K 13/08
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
H05K 9/0032
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
0007Casings
002with localised screening
0022of components mounted on printed circuit boards [PCB]
0024Shield cases mounted on a PCB, e.g. cans, caps, conformal shields
0032having multiple parts, e.g. frames mating with lids
H05K 9/0035
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
0007Casings
002with localised screening
0022of components mounted on printed circuit boards [PCB]
0024Shield cases mounted on a PCB, e.g. cans, caps, conformal shields
0032having multiple parts, e.g. frames mating with lids
0035with retainers mounted beforehand on the PCB, e.g. clips
Y10T 29/53174
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
出願人
  • 富士機械製造株式会社 FUJI MACHINE MFG. CO., LTD. [JP/JP]; 愛知県知立市山町茶碓山19番地 19, Chausuyama, Yamamachi, Chiryu-shi Aichi 4728686, JP
発明者
  • 林 哲生 HAYASHI, Tetsuo; JP
  • 中根 邦靖 NAKANE, Kuniyasu; JP
  • 手嶋 力茂 TESHIMA, Chikashi; JP
代理人
  • 片岡 友希 KATAOKA, Tomoki; 愛知県知立市山町茶碓山19番地 19, Chausuyama, Yamamachi, Chiryu-shi Aichi 4728686, JP
優先権情報
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD
(FR) DISPOSITIF DE MONTAGE DE COMPOSANTS ÉLECTRONIQUES ET PROCÉDÉ DE MONTAGE
(JA) 電子部品装着装置及び装着方法
要約
(EN)
An electronic component mounting device is characterized in being provided with: a substrate transport device which transports a substrate, on which electronic components are mounted, and positions the substrate; a mounting device which positions the electronic component at a mounting position on the substrate and mounts the component; an attaching device which picks up a plurality of parts to be engaged (clips), positions the same at attachment positions on the substrate, and attaches the same; and a placement device which picks up a cover component, on which an engaging portion has been provided, at a predetermined position which covers the electronic component which has been mounted, positions the engaging portion at the position of a corresponding part to be engaged, and places the same.
(FR)
La présente invention concerne un dispositif de montage de composants électroniques caractérisé par le fait qu'il comporte : un dispositif de transport de substrat qui transporte un substrat, sur lequel des composants électroniques sont montés, et qui positionne le substrat ; un dispositif de montage qui positionne le composant électronique à une position de montage sur le substrat et monte le composant ; un dispositif de fixation qui saisit une pluralité de pièces devant être mises en contact (attaches), positionne celles-ci à des positions de fixation sur le substrat, et les fixe ; et un dispositif de positionnement qui saisit un composant couvercle, sur lequel se trouve une partie prise, à une position prédéfinie qui couvre le composant électronique qui a été monté, positionne la partie prise à la position d'une pièce correspondante devant être mise en contact et la met en place.
(JA)
電子部品を装着する基板を搬送して位置決めする基板搬送装置と、前記電子部品を前記基板の装着位置に位置決めして装着する装着装置と、複数の被係合部(クリップ)を採取して前記基板の搭載位置に位置決めして搭載する搭載装置と、装着された前記電子部品をカバーする所定の位置に係合部を設けたカバー部品を採取して該係合部を対応する前記被係合部の位置に位置決めして載置する載置装置、とを備えていることを特徴とする電子部品装着装置。
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