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1. WO2014203843 - 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法

パーマリンク
公開番号 WO/2014/203843
公開日 24.12.2014
国際出願番号 PCT/JP2014/065848
国際出願日 16.06.2014
IPC
C23C 18/18 2006.1
C化学;冶金
23金属質材料への被覆;金属質材料による材料への被覆;化学的表面処理;金属質材料の拡散処理;真空蒸着,スパッタリング,イオン注入法,または化学蒸着による被覆一般;金属質材料の防食または鉱皮の抑制一般
C金属質への被覆;金属材料による材料への被覆;表面への拡散,化学的変換または置換による,金属材料の表面処理;真空蒸着,スパッタリング,イオン注入法または化学蒸着による被覆一般
18液状化合物または溶液のいずれかからなる被覆形成化合物の分解による化学的被覆であって表面材料の反応生成物を被覆層中に残さないもの;接触メッキ
16還元または置換によるもの,例.無電解メッキ
18被覆される材料の前処理
CPC
B01J 31/06
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
31Catalysts comprising hydrides, coordination complexes or organic compounds
02containing organic compounds or metal hydrides
06containing polymers
B01J 31/26
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
31Catalysts comprising hydrides, coordination complexes or organic compounds
26containing in addition, inorganic metal compounds not provided for in groups B01J31/02 - B01J31/24
B01J 31/28
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
31Catalysts comprising hydrides, coordination complexes or organic compounds
26containing in addition, inorganic metal compounds not provided for in groups B01J31/02 - B01J31/24
28of the platinum group metals, iron group metals or copper
C23C 18/1633
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
C23C 18/18
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
C23C 18/1893
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1851of surfaces of non-metallic or semiconducting in organic material
1872by chemical pretreatment
1886Multistep pretreatment
1893with use of organic or inorganic compounds other than metals, first
出願人
  • ＤＩＣ株式会社 DIC CORPORATION [JP]/[JP]
発明者
  • 深澤　憲正 FUKAZAWA Norimasa
  • 新林　昭太 NIIBAYASHI Shota
  • 関根　信博 SEKINE Nobuhiro
  • 佐野　義之 SANO Yoshiyuki
  • 森脇　雅幸 MORIWAKI Masayuki
  • 河村　香 KAWAMURA Kaori
  • 大塚　邦顕 OHTSUKA Kuniaki
  • 姜　俊行 KANG Junhaeng
  • 森口　朋 MORIGUTI Tomo
代理人
  • 志賀　正武 SHIGA Masatake
優先権情報
2013-13101321.06.2013JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) CATALYST FOR ELECTROLESS PLATING, METALLIC COATING FILM PRODUCED USING SAME, AND METHOD FOR PRODUCING SAID METALLIC COATING FILM
(FR) CATALYSEUR POUR PLACAGE ANÉLECTROLYTIQUE, FILM DE REVÊTEMENT MÉTALLIQUE PRODUIT À L'AIDE DE CE DERNIER, ET PROCÉDÉ PERMETTANT DE PRODUIRE LEDIT FILM DE REVÊTEMENT MÉTALLIQUE
(JA) 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法
front page image
要約
(EN) The present invention provides: a catalyst for electroless plating, which is characterized by being a complex of a compound (X) and metal nanoparticles (Y), wherein the compound (X) is produced by polymerizing a monomer mixture (I) that contains a (meth)acrylic acid-type monomer having at least one anionic functional group selected from the group consisting of a carboxy group, a phosphoric acid group, a phosphorous acid group, a sulfonic acid group, a sulfinic acid group and a sulfenic acid group; a metallic coating film produced using the catalyst; and a method for producing a metallic coating film using the catalyst.
(FR) La présente invention se rapporte : à un catalyseur pour placage anélectrolytique qui est caractérisé en ce qu'il est un complexe d'un composé (X) et de nanoparticules métalliques (Y), le composé (X) étant produit par polymérisation d'un mélange de monomères (I) qui contient un monomère de type acide (méth)acrylique qui comporte au moins un groupe fonctionnel anionique sélectionné dans le groupe constitué par un groupe carboxy, un groupe acide phosphorique, un groupe acide phosphoreux, un groupe acide sulfonique, un groupe acide sulfinique et un groupe acide sulfénique ; à un film de revêtement métallique produit à l'aide du catalyseur ; et à un procédé permettant de produire un film de revêtement métallique à l'aide du catalyseur.
(JA) 　本発明は、カルボキシ基、リン酸基、亜リン酸基、スルホン酸基、スルフィン酸基及びスルフェン酸基からなる群から選ばれる１種以上のアニオン性官能基を有する（メタ）アクリル酸系単量体を含有する単量体混合物（Ｉ）を重合してなる化合物（Ｘ）と、金属ナノ粒子（Ｙ）との複合体であることを特徴とする無電解めっき用触媒、該触媒を用いた金属皮膜、および該触媒を用いた金属皮膜の製造方法を提供する。
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