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出願の表示

1. WO2014171334 - フレキシブル基板

公開番号 WO/2014/171334
公開日 23.10.2014
国際出願番号 PCT/JP2014/059743
国際出願日 02.04.2014
IPC
H05K 1/02 2006.1
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
CPC
H05K 1/0213
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
H05K 1/0271
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
H05K 1/028
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
028Bending or folding regions of flexible printed circuits
H05K 1/0298
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
0298Multilayer circuits
H05K 1/0393
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0393Flexible materials
H05K 1/118
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
118specially for flexible printed circuits, e.g. using folded portions
出願人
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
発明者
  • 大坪 喜人 OTSUBO, Yoshihito
代理人
  • 特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.
優先権情報
2013-08836119.04.2013JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) FLEXIBLE SUBSTRATE
(FR) SUBSTRAT SOUPLE
(JA) フレキシブル基板
要約
(EN) A flexible substrate (101) is provided with: a substrate (1) including wiring on the surface or the interior; components (3) disposed on the surface or the interior of the substrate (1) and electrically connected to the wiring; and an external connection conductor (4) provided on the surface of the substrate (1). The substrate (1), viewed in a planar manner, includes a trunk section (11) on which the external connection conductor (4) is disposed, and a flared section (12) flared out from the trunk section (11). The flared section (12) has a first constricted section (21) provided in the connection location with the trunk section (11), and a first wide section (31) provided at the end of the constricted section (21), the first wide section (31) having a width that is greater than that of the first constricted section (21), and the components (3) being disposed on the first wide section (31).
(FR) Substrat souple (101) comportant: un substrat (1) comprenant un câblage sur la surface ou l'intérieur; des composants (3) disposés sur la surface ou l'intérieur du substrat (1) et reliés électriquement au câblage; et un conducteur (4) de raccordement externe placé sur la surface du substrat (1). Le substrat (1), dans une vue en plan, comprend une section principale (11) sur laquelle est disposé le conducteur (4) de raccordement externe, et une section évasée (12) qui s'évase à partir de la section principale (11). La section évasée (12) comprend une première section rétrécie (21) située au lieu de jonction avec la section principale (11), et une première section large (31) située à l'extrémité de la section rétrécie (21), la première section large (31) présentant une largeur supérieure à celle de la première section rétrécie (21), et les composants (3) étant disposés sur la première section large (31).
(JA)  フレキシブル基板(101)は、表面または内部に配線を含む基板(1)と、基板(1)の表面または内部に配置され、前記配線に電気的に接続された部品(3)と、基板(1)の表面に設けられた外部接続導体(4)とを備える。平面的に見て基板(1)は、外部接続導体(4)が配置された基幹部(11)と、基幹部(11)から張り出した張出部(12)とを含む。張出部(12)は、基幹部(11)との接続箇所に設けられた第1くびれ部(21)と、第1くびれ部(21)の先に設けられ、第1くびれ部(21)より幅が広くなった第1幅広部(31)とを有し、部品(3)は第1幅広部(31)に配置されている。
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