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1. WO2014129196 - 電子部品実装システムおよび電子部品実装方法

公開番号 WO/2014/129196
公開日 28.08.2014
国際出願番号 PCT/JP2014/000888
国際出願日 20.02.2014
IPC
H05K 13/00 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
13電気部品の組立体の製造または調整に特に適した装置または方法
CPC
B65G 15/12
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
15Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
10comprising two or more co-operating endless surfaces with parallel longitudinal axes, or a multiplicity of parallel elements, e.g. ropes defining an endless surface
12with two or more endless belts
B65G 15/22
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
15Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
22comprising a series of co-operating units
B65G 15/24
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
15Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
22comprising a series of co-operating units
24in tandem
H05K 13/0061
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
H05K 13/0069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
0069Holders for printed circuit boards
H05K 13/085
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
085Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
出願人
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
発明者
  • 東 雅之 HIGASHI, Masayuki
  • 森 泰祐 MORI, Taisuke
  • 河内 良二 KOUCHI, Ryouji
  • 山崎 ▲琢▼也 YAMAZAKI, Takuya
  • 前園 尚 MAEZONO, Hisashi
  • 安藤 寛 ANDO, Hiroshi
代理人
  • 橋本 公秀 HASHIMOTO, Kimihide
優先権情報
2013-03287022.02.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
(FR) SYSTÈME DE MONTAGE DE COMPOSANT ÉLECTRONIQUE ET PROCÉDÉ DE MONTAGE DE COMPOSANT ÉLECTRONIQUE
(JA) 電子部品実装システムおよび電子部品実装方法
要約
(EN)
In a component mounting line which connects component mounting machines (M5, M6, …) having a configuration provided with a first substrate carrier mechanism (16A) and a second substrate carrier mechanism (16B), which have substrate retaining units which convey two types of substrates (4A, 4B), which have been passed from an upstream-side device, to a substrate conveying direction so as to align and retain the same, on the basis of a substrate request signal issued from a component mounting machine (M5) disposed at the front of a component mounting line, the 2 types of substrates (4A, 4B) are mixed and allocated to each of the first substrate carrier mechanism (16A) and the second substrate carrier mechanism (16B). As a result, it is possible to improve production efficiency for the two types of substrates (4A, 4B) of different mounting workloads.
(FR)
Selon l'invention, dans une ligne de montage de composant qui connecte des machines de montage de composant (M5, M6, …) ayant une configuration comprenant un premier mécanisme de transport de substrat (16A) et un second mécanisme de transport de substrat (16B), qui ont des unités de rétention de substrat qui transportent deux types de substrats (4A, 4B), qui ont été passés à partir d'un dispositif côté amont vers une direction de transport de substrat de façon à aligner et retenir ceux-ci, sur la base d'un signal de requête de substrat provenant d'une machine de montage de composant (M5) disposée à l'avant d'une ligne de montage de composant, les 2 types de substrats (4A,4B) sont mélangés et attribués à chacun du premier mécanisme de transport de substrat (16A) et du second mécanisme de transport de substrat (16B). En résultat, il est possible d'améliorer un rendement de production pour les deux types de substrats (4A, 4B) de différentes charges de travail de montage.
(JA)
 上流側装置から受け渡された2種類の基板4A,4Bを基板搬送方向に搬送し位置決めして保持する基板保持部を有する第1の基板搬送機構16Aおよび第2の基板搬送機構16Bを備えた構成の部品実装装置M5、M6・・・を連結した部品実装ラインにおいて、部品実装ラインの先頭に配置された部品実装装置M5から発せられる基板要求信号に基づいて、第1の基板搬送機構16Aおよび第2の基板搬送機構16Bのそれぞれに、2種類の基板4A,4Bを混在させて振り分ける。これにより、実装作業負荷が異なる2種類の基板4A,4Bを対象として、生産効率を向上させることができる。
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