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出願の表示

1. WO2014125852 - 回路基板およびその製造方法

公開番号 WO/2014/125852
公開日 21.08.2014
国際出願番号 PCT/JP2014/050348
国際出願日 10.01.2014
IPC
H05K 3/46 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
46多重層回路の製造
H05K 1/02 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
CPC
H01L 2224/16227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16227the bump connector connecting to a bond pad of the item
H01L 2924/15313
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
151Die mounting substrate
153Connection portion
1531the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
15313being a land array, e.g. LGA
H01L 2924/19105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
191Disposition
19101of discrete passive components
19105in a side-by-side arrangement on a common die mounting substrate
H05K 1/0243
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0237High frequency adaptations
0243Printed circuits associated with mounted high frequency components
H05K 1/0271
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
H05K 1/028
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
028Bending or folding regions of flexible printed circuits
出願人
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
発明者
  • 用水 邦明 YOSUI Kuniaki
代理人
  • 特許業務法人プロフィック特許事務所 PROFIC PC
優先権情報
2013-02634014.02.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) CIRCUIT SUBSTRATE, AND PRODUCTION METHOD THEREFOR
(FR) SUBSTRAT DE CIRCUIT ET SON PROCÉDÉ DE PRODUCTION
(JA) 回路基板およびその製造方法
要約
(EN)
In order to make sufficient use of a characteristic of base material sheets, this circuit substrate (1) is provided with: a substrate main body (2) wherein a plurality of base material sheets (10) comprising a flexible material are pressure bonded by being laminated in a prescribed direction; and at least one planar conductor pattern (8a, 8b) which is formed in the substrate main body (2), and has recessed parts (81a, 81b) and protruding parts (82a, 82b) that extend orthogonally in the prescribed direction. The recessed parts (81a, 81b) are indented parallel to the prescribed direction, and the protruding parts (82a, 82b) protrude in the opposite direction to the indentation direction of the recessed parts (81a, 81b).
(FR)
Afin d'exploiter au mieux une caractéristique de feuilles de matériau de base, le présent substrat de circuit (1) comprend : un corps principal de substrat (2) dans lequel une pluralité de feuilles de matériau de base (10) comprenant un matériau souple sont soudées par compression en étant stratifiées dans une direction prescrite ; et au moins un motif conducteur plan (8a, 8b) formé dans le corps principal de substrat (2), et comporte des parties en creux (81a, 81b) et des parties en saillie (82a, 82b) s'étendant perpendiculairement à la direction prescrite. Les parties en creux (81a, 81b) sont indentées parallèlement à la direction prescrite et les parties en saillie (82a, 82b) font saillie dans la direction opposée à la direction d'indentation des parties en creux (81a, 81b).
(JA)
 基材シートの特性を十分に活用するために、回路基板(1)は、可撓性材料からなる複数の基材シート(10)を所定方向に積層して圧着した基板本体(2)と、基板本体(2)に形成されかつ所定方向の直交方向に延在する凹部(81a,81b)および凸部(82a,82b)を有する、少なくとも一つの面状導体パターン(8a,8b)と、を備えている。凹部(81a,81b)は所定方向と平行な方向に窪み、凸部(82a,82b)は、凹部(81a,81b)が窪む方向とは逆方向に突出する。
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