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1. WO2014125528 - 部品供給装置および部品供給方法

公開番号 WO/2014/125528
公開日 21.08.2014
国際出願番号 PCT/JP2013/005198
国際出願日 03.09.2013
IPC
H05K 13/02 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
13電気部品の組立体の製造または調整に特に適した装置または方法
02部品の供給
CPC
B32B 43/006
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
43Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
006Delaminating
H05K 13/0417
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
0417Feeding with belts or tapes
H05K 13/0419
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
0417Feeding with belts or tapes
0419tape feeders
Y10T 156/1195
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
156Adhesive bonding and miscellaneous chemical manufacture
11Methods of delaminating, per se; i.e. , separating at bonding face
1168Gripping and pulling work apart during delaminating
1195Delaminating from release surface
Y10T 156/1961
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
156Adhesive bonding and miscellaneous chemical manufacture
19Delaminating means
1961Severing delaminating means [e.g., chisel, etc.]
出願人
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
発明者
  • 木谷 実 KITANI, Minoru
  • 金井 一憲 KANAI, Kazunori
  • 城戸 一夫 KIDO, Kazuo
  • 阿部 成孝 ABE, Seikou
代理人
  • 鮫島 睦 SAMEJIMA, Mutsumi
優先権情報
2013-02738515.02.2013JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) COMPONENT SUPPLY DEVICE AND COMPONENT SUPPLY METHOD
(FR) DISPOSITIF ET PROCÉDÉ DE DISTRIBUTION DE COMPOSANT
(JA) 部品供給装置および部品供給方法
要約
(EN)
A component supply device (10) has: a main tape insertion slot (12a); a component exit slot (12c) for extracting a component from a carrier tape (200) within a main unit portion (12); a main tape path (P1) which extends from the main tape insertion slot (12a) to below the component extraction slot (12c) within the main unit portion (12); a top tape stripping unit (20) which strips a top tape (206) from the carrier tape (200) upon the main tape path (P1) of the upstream side of the component extraction slot (12c); an auxiliary tape insertion slot (12b); an auxiliary tape path (P2) which extends from the auxiliary tape insertion slot (12b) within the main unit portion (12), and merges with a slanted path portion (P1b) of the main tape path (P1) at a merging point (M) at the upstream side of the top tape stripping unit (20); and at least one first sprocket (16 and 18) which engages with the carrier tape (200) upon the main tape path (P1) of the downstream side of the merging point (M). The length of the auxiliary tape path (P2) is shorter than the length of the main tape path (P1) from the main tape insertion slot (12a) to the merging point (M).
(FR)
L'invention concerne un dispositif de distribution de composant (10) qui comprend : une fente d'insertion de bande principale (12a); une fente de sortie de composant (12c) pour extraire un composant d'une bande de transport (200) dans une partie principale de l'unité (12); un chemin de bande principal (P1) qui s'étend de la fente d'insertion de bande principale (12a) jusque sous la fente d'extraction de composant (12c) dans la partie principale de l'unité (12); une unité de décapage de bande supérieure (20) qui décape une bande supérieure (206) de la bande de transport (200) sur le chemin de bande principal (P1) du côté en amont de la fente d'extraction de composant (12c); une fente d'insertion de bande auxiliaire (12b); un chemin de bande auxiliaire (P2) qui s'étend de la fente d'insertion de bande auxiliaire (12b) dans la partie principale de l'unité (12), et fusionne avec une partie de chemin inclinée (P1b) du chemin de bande principal (P1) au niveau d'un point de fusion (M) en amont de l'unité de décapage de bande supérieure (20); et au moins un premier pignon (16 et 18) qui entre en prise avec la bande de transport (200) sur le chemin de bande principal (P1) du côté en aval du point de fusion (M). La longueur du chemin de bande auxiliaire (P2) est plus courte que celle du chemin de bande principal (P1) en partant de la fente d'insertion de bande principale (12a) jusqu'au point de fusion (M).
(JA)
 部品供給装置10は、主テープ投入口12aと、本体部12内のキャリアテープ200から部品を取出すための部品取出口12cと、主テープ投入口12bから部品取出口12cの下方まで本体部12内を延在する主テープ経路P1と、部品取出口12cの上流側の主テープ経路P1上でキャリアテープ200からトップテープ206を剥離するトップテープ剥離部20と、副テープ投入口12bと、副テープ投入口12bから本体部12内を延在し、トップテープ剥離部20の上流側の合流点Mで主テープ経路P1の傾斜経路部P1bと合流する副テープ経路P2と、合流点Mの下流側の主テープ経路P1上でキャリアテープ200と係合する少なくとも1つの第1のスプロケット16、18とを有する。副テープ経路P2の長さが、主テープ投入口12aから合流点Mまでの主テープ経路P1の長さより短い。
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