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1. WO2013080560 - 無線モジュール

パーマリンク
公開番号 WO/2013/080560
公開日 06.06.2013
国際出願番号 PCT/JP2012/007682
国際出願日 29.11.2012
IPC
H01P 5/08 2006.01
H電気
01基本的電気素子
P導波管;導波管型の共振器,線路または他の装置
5導波管型の結合装置
08異なる種類の線路または装置の接続用
H01L 23/12 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
12マウント,例.分離できない絶縁基板
H05K 1/02 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
H05K 1/14 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
142つ以上の印刷回路の構造的結合
CPC
H01L 2223/6622
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6605High-frequency electrical connections
6616Vertical connections, e.g. vias
6622Coaxial feed-throughs in active or passive substrates
H01L 2223/6677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6661for passive devices
6677for antenna, e.g. antenna included within housing of semiconductor device
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 23/49811
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
H01L 23/49833
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49833the chip support structure consisting of a plurality of insulating substrates
H01L 23/66
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
64Impedance arrangements
66High-frequency adaptations
出願人
  • パナソニック株式会社 PANASONIC CORPORATION [JP]/[JP]
発明者
  • 藤田　卓 FUJITA, Suguru
  • 塩崎　亮佑 SHIOZAKI, Ryosuke
代理人
  • 橋本　公秀 HASHIMOTO, Kimihide
優先権情報
2011-26501902.12.2011JP
2011-26804207.12.2011JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) WIRELESS MODULE
(FR) MODULE SANS FIL
(JA) 無線モジュール
front page image
要約
(EN)
The present invention has a first circuit board (11) on which is mounted the mounting component of a wireless circuit, and a second circuit board (12) laminated and disposed in relation to the first circuit board (11); the first circuit board (11) and the second circuit board (12) being electrically connected by a connecting member (18) comprising a Cu-core ball and other parts. A conductive member (23) for adjusting impedance is provided laterally to the connecting member (18) in a position a predetermined distance from the connecting member (18), to maintain the signal path of the connecting member (18) at a predetermined impedance.
(FR)
Le module sans fil de l'invention possède un premier substrat (11) sur lequel se trouve un composant de montage d'un circuit sans fil, et un second substrat (12) disposé de manière stratifiée sur le premier substrat (11). Le premier et le second substrat (11, 12) sont électriquement connectés par un élément de connexion (18) mettant en œuvre une bille de noyau Cu, ou similaire. Un élément conducteur (23) destiné à ajuster une impédance, est agencé en une position à distance prédéfinie de l'élément de connexion (18), côté latéral de ce dernier. Un trajet de signal de l'élément de connexion (18) satisfait ainsi une impédance prédéfinie.
(JA)
　無線回路の実装部品を搭載する第１基板１１と、第１基板１１に対して積層して配置する第２基板１２とを有し、第１基板１１と第２基板１２とがＣｕコアボール等による接続部材１８によって電気的に接続される。接続部材１８の側方には、接続部材１８に対して所定距離となる位置に、インピーダンス調整用の導電部材２３が設けられ、接続部材１８の信号経路が所定のインピーダンスとなるようにしている。
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