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1. WO2013080317 - 半導体装置、及び車載用電力変換装置

公開番号 WO/2013/080317
公開日 06.06.2013
国際出願番号 PCT/JP2011/077620
国際出願日 30.11.2011
IPC
H01L 23/40 2006.1
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
34冷却,加熱,換気または温度補償用装置
40分離できる冷却または加熱装置のための取り付けまたは固着手段
H05K 7/20 2006.1
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
7異なる型の電気装置に共通の構造的細部
20冷却,換気または加熱を容易にするための変形
CPC
H01L 2023/4018
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4018characterised by the type of device to be heated or cooled
H01L 2023/4087
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4075Mechanical elements
4087Mounting accessories, interposers, clamping or screwing parts
H01L 23/4006
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
H01L 23/4338
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
433Auxiliary members ; in containers; characterised by their shape, e.g. pistons
4338Pistons, e.g. spring-loaded members
H01L 23/467
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
467by flowing gases, e.g. air
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
出願人
  • 三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP]/[JP] (AllExceptUS)
  • 小玉 勝久 KODAMA, Katsuhisa (UsOnly)
発明者
  • 小玉 勝久 KODAMA, Katsuhisa
代理人
  • 曾我 道治 SOGA, Michiharu
優先権情報
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SEMICONDUCTOR DEVICE, AND ON-BOARD POWER CONVERSION DEVICE
(FR) DISPOSITIF SEMI-CONDUCTEUR ET DISPOSITIF DE CONVERSION DE PUISSANCE EMBARQUÉ
(JA) 半導体装置、及び車載用電力変換装置
要約
(EN) The purpose of the present invention is to obtain a semiconductor device capable of both improving the heat dissipation of a heat-generating element, and reducing the mounting area for a mounting substrate. This semiconductor device comprises: the heat-generating element (1) connected via a terminal (1a) extending in the vertical direction relative to the mounting substrate (5); a heat-dissipating member (2) having an element-contact section (2a) in surface-contact with an attachment surface (1e) for this heat-generating element (1), via a heat-dissipating sheet (7); a first pressing member (3) and a second pressing member (4) that come in contact with the heat-generating element (1), and press the heat-generating element (1) on to the heat-dissipating member (2); and a fixing screw (6) that fixes the first pressing member (3) to the heat-dissipating member (2) through a through-hole (3c) formed in the first pressing member (3) parallel to the attachment surface (1e). Sloping surfaces are formed in the first pressing member (3) and the second pressing member (4), whereby the axial force component of the tightening force of the fixing screw (6) is generated in the vertical direction relative to the attachment surface (1e).
(FR) L'objet de la présente invention est d'obtenir un dispositif semi-conducteur capable à la fois d'améliorer la dissipation de chaleur d'un élément générateur de chaleur et de réduire l'aire de montage pour un substrat de montage. Ce dispositif semi-conducteur comprend : l'élément générateur de chaleur (1) connecté via une borne (1a) s'étendant dans la direction verticale par rapport au substrat de montage (5) ; un organe dissipateur de chaleur (2) ayant une section de contact à l'élément (2a) en surface avec une surface de fixation (1e) pour cet élément générateur de chaleur (1), via une feuille dissipatrice de chaleur (7) ; un premier organe presseur (3) et un second organe presseur (4) qui entrent en contact avec l'élément générateur de chaleur (1), et pressent l'élément générateur de chaleur (1) sur l'organe dissipateur de chaleur (2) ; et une vis de fixation (6) qui fixe le premier organe presseur (3) à l'organe dissipateur de chaleur (2) par un trou traversant (3c) formé dans le premier organe presseur (3) parallèlement à la surface de fixation (1e). Des surfaces inclinées sont formées dans le premier organe presseur (3) et le second organe presseur (4), la composante de force axiale de la force de serrage de la vis de fixation (6) étant générée dans la direction verticale par rapport à la surface de fixation (1e).
(JA)  発熱素子の放熱性が向上するとともに、実装基板の実装面積が削減することができる半導体装置を得る。この発明の半導体装置は、実装基板5に対して垂直方向に延びた端子1aを介して接続された発熱素子1と、この発熱素子1の取付面1eに放熱シート7を介して面接触した素子接触部位2aを有する放熱部材2と、発熱素子1に接触し発熱素子1を放熱部材2に押圧する第1の押圧部材3及び第2の押圧部材4と、第1の押圧部材3に取付面1eに対して平行に形成された貫通孔3cを通じて第1の押圧部材3を放熱部材2に固定する固定ネジ6とを備え、第1の押圧部材3及び第2の押圧部材4には、固定ネジ6の締付力の軸力の分力が取付面1eに対して垂直方向に生じる傾斜面が形成されている。
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