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1. WO2013014978 - 実装基板および発光モジュール

公開番号 WO/2013/014978
公開日 31.01.2013
国際出願番号 PCT/JP2012/058065
国際出願日 28.03.2012
IPC
H01L 33/64 2010.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
33光の放出に特に適用される少なくとも1つの電位障壁または表面障壁を有する半導体装置;それらの装置またはその部品の製造,あるいは処理に特に適用される方法または装置;それらの装置の細部
48半導体素子本体のパッケージに特徴のあるもの
64放熱または冷却要素
F21V 19/00 2006.01
F機械工学;照明;加熱;武器;爆破
21照明
V照明装置またはそのシステムの機能的特徴あるいは細部;他に分類されない,その他の物品と照明装置との構造的な組み合わせ
19光源またはランプホルダの固定
F21V 29/00 2006.01
F機械工学;照明;加熱;武器;爆破
21照明
V照明装置またはそのシステムの機能的特徴あるいは細部;他に分類されない,その他の物品と照明装置との構造的な組み合わせ
29熱的損傷からの照明装置の防護;照明装置またはシステムに特に適合した冷却または加熱手段
H01L 23/12 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
12マウント,例.分離できない絶縁基板
H01L 23/36 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
34冷却,加熱,換気または温度補償用装置
36冷却または加熱を容易にするための材料の選択または成形,例.ヒート・シンク
F21Y 101/02 2006.01
F機械工学;照明;加熱;武器;爆破
21照明
Y光源の形状もしくは種類または放射された光の色に関するサブクラスF21K,F21L,F21S,およびF21Vに関連するインデキシング系列
101,,
02,
CPC
H01L 2224/45124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
45124Aluminium (Al) as principal constituent
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/48228
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
48228the bond pad being disposed in a recess of the surface of the item
H01L 2224/48465
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
48463the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
48465the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
出願人
  • パナソニック株式会社 PANASONIC CORPORATION [JP]/[JP] (AllExceptUS)
  • 浦野 洋二 URANO, Yoji (UsOnly)
  • 畠 一志 HATA, Hitoshi (UsOnly)
発明者
  • 浦野 洋二 URANO, Yoji
  • 畠 一志 HATA, Hitoshi
代理人
  • 西川 惠清 NISHIKAWA, Yoshikiyo
優先権情報
2011-16568828.07.2011JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) MOUNTING SUBSTRATE AND LIGHT-EMITTING MODULE
(FR) SUBSTRAT DE MONTAGE ET MODULE ÉLECTROLUMINESCENT
(JA) 実装基板および発光モジュール
要約
(EN)
Provided are a mounting substrate and a light-emitting module such that heat radiation can be improved. The mounting substrate (2) is provided with: a heat transfer plate (21) that is formed of metal, and that can have electronic parts mounted on one side thereof; a wiring board (22) with wiring patterns (22b), onto which the electronic parts can be connected, formed on one face of an organic insulation substrate (22a), said wiring board (22) being arranged on the other side of the heat transfer plate (21); and an insulation layer (23) interposed between the heat transfer plate (21) and the wiring board (22). The heat transfer plate (21) has formed thereon through holes (21b) exposing portions of the wiring patterns (22b) where the electronic parts are to be connected. In the mounting substrate (2), the planar size of the wiring board (22) to be larger than the planar size of the heat transfer plate (21), and the wiring patterns (22b) of the wiring board (22) are spread out to areas where the wiring patterns (22b) will not be superimposed upon the heat transfer plate (21). The light-emitting module is configured by mounting solid-state light emitting elements (3) onto the mounting substrate (2) as the electronic parts.
(FR)
L'invention concerne un substrat de montage et un module électroluminescent tels que le rayonnement thermique peut être amélioré. Le substrat de montage (2) comprend : une plaque de transfert thermique (21) qui est faite de métal et qui peut recevoir des doigts électroniques qui sont montés sur l'un de ses côtés ; une carte de circuits imprimés (22) avec des motifs de raccordement (22b) auxquels les doigts électroniques peuvent être raccordés et qui sont formés sur un côté d'un substrat organique isolant (22a), ladite carte de circuits imprimés (22) étant disposée sur l'autre côté de la plaque de transfert thermique (21) ; et une couche isolante (23) interposée entre la plaque de transfert thermique (21) et la carte de circuits imprimés (22). La plaque de transfert thermique (21) comporte des trous traversants (21b) qui exposent des parties des motifs de raccordement (22b) où les doigts électroniques doivent être connectés. Dans le substrat de montage (2), la taille en plan de la carte de circuits imprimés (22) est supérieure à la taille en plan de la plaque de transfert thermique (21) et les motifs de raccordement (22b) de la carte de circuits imprimés (22) sont distribués dans des zones où les motifs de raccordement (22b) ne se superposeront pas avec la plaque de transfert thermique (21). Le module électroluminescent est configuré en montant comme doigts électroniques des éléments électroluminescents à semi-conducteurs (3) sur le substrat de montage (2).
(JA)
 放熱性を向上させることが可能な実装基板および発光モジュールを提供する。実装基板2は、金属板により形成され電子部品を一面側に搭載可能な伝熱板21と、電子部品を電気的に接続可能な配線パターン22bが有機系絶縁基板22aの片面に設けられ伝熱板21の他面側に配置された配線基板22と、伝熱板21と配線基板22との間に介在する絶縁層23とを備えている。伝熱板21は、配線パターン22bにおける、電子部品の接続用部位を露出させる貫通孔21bが形成されている。実装基板2は、配線基板22の平面サイズが伝熱板21の平面サイズよりも大きく、配線基板22の配線パターン22bが、伝熱板21に重ならない領域まで広がっている。発光モジュールは、実装基板2に電子部品として固体発光素子3を実装して構成する。
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